SI8900EDB Datasheet, PDF (5/5 Pages) Vishay Siliconix – Bi-Directional N-Channel 20-V (D-S) MOSFET

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PACKAGE OUTLINE
MICRO FOOT: 10−BUMP (2 X 5, 0.8−mm PITCH)
10 O 0.30 X 0.31
Note 3
Solder Mask O X 0.40
A₂
A
e
A₁
e
Recommended Land
8900E
xxx
b Diamerter
E
Si8900EDB
Vishay Siliconix
Silicon
Bump Note 2
S₂
e
Mark on Backside of Die
S₁
e
D
NOTES (Unless Otherwise Specified):
1. Laser mark on the silicon die back, coated with a thin metal.
2. Bumps are Eutectic solder 63/57 Sn/Pb.
3. Non-solder mask defined copper landing pad.
MILLIMETERS*
INCHES
Dim
Min
Max
Min
Max
A
0.600
A₁
0.260
A₂
0.340
b
0.370
D
4.050
E
1.980
e
0.750
S₁
0.430
S₂
0.580
0.650
0.290
0.360
0.410
4.060
2.000
0.850
0.450
0.600
0.0236
0.102
0.0134
0.0146
0.1594
0.0780
0.0295
0.0169
0.0228
0.0256
0.0114
0.0142
0.0161
0.1598
0.0787
0.0335
0.0177
0.0236
* Use millimeters as the primary measurement.
Document Number: 71830
S-21474—Rev. D, 26-Aug-02
www.vishay.com
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