SUM33N20-60P Datasheet, PDF (2/6 Pages) Vishay Siliconix – N-Channel 200-V (D-S) 175 C MOSFET

SUM33N20-60P
Vishay Siliconix
SPECIFICATIONS T_J = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Static
Drain-Source Breakdown Voltage
V_(BR)DSS
V_DS = 0 V, I_D = 250 µA
Gate Threshold Voltage
V_GS(th)
V_DS = V_GS, I_D = 250 µA
Gate-Body Leakage
I_GSS
V_DS = 0 V, V_GS = ± 20 V
V_DS = 0 V, V_GS = ± 25 V
V_DS = 200 V, V_GS = 0 V
Zero Gate Voltage Drain Current
I_DSS
V_DS = 200 V, V_GS = 0 V, T_J = 100 °C
On-State Drain Current^a
I_D(on)
V_DS = 200 V, V_GS = 0 V, T_J = 150 °C
V_DS ≥ 10 V, V_GS = 10 V
V_GS = 10 V, I_D = 20 A
Drain-Source On-State Resistance^a
r_DS(on)
V_GS = 15 V, I_D = 20 A
V_GS = 10 V, I_D = 20 A, T_J = 100 °C
Forward Transconductance^a
Dynamic^b
V_GS = 10 V, I_D = 20 A, T_J = 150 °C
g_fs
V_DS = 15 V, I_D = 20 A
Input Capacitance
C_iss
Output Capacitance
C_oss
V_GS = 0 V, V_DS = 25 V, f = 1 MHz
Reverse Transfer Capacitance
C_rss
Total Gate Charge^c
Q_g
V_DS = 100 V, V_GS = 15 V, I_D = 50 A
Gate-Source Charge^c
Gate-Drain Charge^c
Q_gs
V_DS = 100 V, V_GS = 10 V, I_D = 50 A
Q_gd
Gate Resistance
R_g
f = 1 MHz
Turn-On Delay Time^c
t_d(on)
Rise Time^c
Turn-Off Delay Time^c
t_r
t_d(off)
V_DD = 100 V, R_L = 2 Ω
I_D ≅ 50 A, V_GEN = 10 V, R_g = 1 Ω
Fall Time^c
t_f
Source-Drain Diode Ratings and Characteristics (T_C = 25 °C)^b
Continuous Current
I_S
Pulsed Current
I_SM
Forward Voltage^a
V_SD
I_F = 20 A, V_GS = 0 V
Reverse Recovery Time
t_rr
Peak Reverse Recovery Current
I_RM(REC)
Reverse Recovery Charge
Q_rr
I_F = 40 A, di/dt = 100 A/µs
Reverse Recovery Fall Time
t_a
Reverse Recovery Rise Time
t_b
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Min
Typ
Max
200
2.5
4.5
± 100
± 300
1
25
250
40
0.049
0.060
0.0485 0.059
0.110
0.144
25
2735
271
117
75
113
53
80
14
17.5
1.2
1.8
16
25
170
260
26
40
9
18
33
80
0.86
1.5
114
170
8
12
0.46
0.69
82
32
Unit
V
nA
µA
A
Ω
S
pF
nC
Ω
ns
A
V
ns
A
µC
nS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 74291
S-62209-Rev. A, 30-Oct-06