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SI8902EDB_08 Datasheet, PDF (2/9 Pages) Vishay Siliconix – Bi-Directional N-Channel 20-V (D-S) MOSFET
Si8902EDB
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Source Current
On-State Source Currenta
VGS(th)
IGSS
IS1S2
IS(on)
Source1-Source2 On State Resistancea RS1S2(on)
Forward Transconductancea
gfs
Dynamicb
VSS = VGS, ID = 980 µA
VSS = 0 V, VGS = ± 4.5 V
VSS = 0 V, VGS = ± 12 V
VSS = 20 V, VGS = 0 V
VSS = 20 V, VGS = 0 V, TJ = 85 °C
VSS = 5 V, VGS = 4.5 V
VGS = 4.5 V, ISS = 1 A
VGS = 3.7 V, ISS = 1 A
VGS = 2.5 V, ISS = 1 A
VGS = 1.8 V, ISS = 1 A
VSS = 10 V, ISS = 1 A
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
td(on)
tr
td(off)
tf
VSS = 10 V, RL = 10 Ω
ISS ≅ 1 A, VGEN = 4.5 V, Rg = 6 Ω
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Min.
Typ.
Max.
Unit
0.45
1.0
V
±4
µA
± 10
mA
1
µA
5
5
A
0.038 0.045
0.041 0.048
Ω
0.048 0.057
0.060 0.072
20
S
1
1.5
3
4.5
µs
17
26
10
15
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
20
IGSS at 25 °C (mA)
16
12
8
4
10 000
1000
100
10
TJ = 150 °C
1
TJ = 25 °C
0.1
0
0
3
6
9
12
15
VGS - Gate-to-Source Voltage (V)
Gate-Current vs. Gate-Source Voltage
0.01
0
3
6
9
12
15
VGS - Gate-to-Source Voltage (V)
Gate Current vs. Gate-Source Voltage
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2
Document Number: 71862
S-83049-Rev. I, 22-Dec-08