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SI5513DC Datasheet, PDF (2/7 Pages) Vishay Siliconix – Complementary 20-V (D-S) MOSFET
Si5513DC
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Static
Gate Threshold Voltage
VGS(th)
VDS = VGS, ID = 250 mA
VDS = VGS, ID = −250 mA
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = "12 V
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward Voltagea
Dynamicb
IDSS
ID(on)
rDS(on)
gfs
VSD
VDS = 20 V, VGS = 0 V
VDS = −20 V, VGS = 0 V
VDS = 20 V, VGS = 0 V, TJ = 70_C
VDS = − 20 V, VGS = 0 V, TJ = 70_C
VDS w 5 V, VGS = 4.5 V
VDS p −5 V, VGS = −4.5 V
VGS = 4.5 V, ID = 3.1 A
VGS = −4.5 V, ID = −2.1 A
VGS = 2.5 V, ID = 2.3 A
VGS = −2.5 V, ID = −1.7 A
VDS = 10 V, ID = 3.1 A
VDS = −10 V, ID = −2.1 A
IS = 0.9 A, VGS = 0 V
IS = −0.9 A, VGS = 0 V
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Qg
N-Channel
VDS = 10 V, VGS = 4.5 V, ID = 3.1 A
Qgs
P-Channel
VDS = −10 V, VGS = −4.5 V, ID = −2.1 A
Qgd
Turn-On Delay Time
td(on)
Rise Time
tr
Turn-Off Delay Time
td(off)
Fall Time
tf
Source-Drain
Reverse Recovery Time
trr
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%,
b. Guaranteed by design, not subject to production testing.
N-Channel
VDD = 10 V, RL = 10 W
ID ^ 1 A, VGEN = 4.5 V, Rg = 6 W
P-Channel
VDD = −10 V, RL = 10 W
ID ^ −1 A, VGEN = −4.5 V, Rg = 6 W
IF = 0.9 A, di/dt = 100 A/ms
IF = −0.9 A, di/dt = 100 A/ms
Min Typ Max Unit
N-Ch
P-Ch
0.6
−0.6
1.5
V
−1.5
N-Ch
P-Ch
"100
nA
"100
N-Ch
1
P-Ch
N-Ch
−1
mA
5
P-Ch
−5
N-Ch
10
A
P-Ch
−10
N-Ch
0.065 0.075
P-Ch
N-Ch
0.130 0.155
W
0.115 0.134
P-Ch
0.215 0.260
N-Ch
8
S
P-Ch
5
N-Ch
P-Ch
0.8
1.2
V
−0.8
−1.2
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
N-Ch
P-Ch
4
6
3
6
0.6
nC
0.9
1.3
0.6
12
18
13
20
35
55
35
55
19
30
ns
25
40
9
15
25
40
40
80
40
80
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
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2
Document Number: 71186
S-42138—Rev. F, 15-Nov-04