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SI4955DY_05 Datasheet, PDF (2/9 Pages) Vishay Siliconix – Asymmetrical Dual P-Channel 30-V/20-V (D-S) MOSFETs
Si4955DY
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Static
Gate Threshold Voltage
VGS(th)
VDS = VGS, ID = - 250 µA
VDS = VGS, ID = - 250 µA
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
VDS = 0 V, VGS = ± 8 V
VDS = - 30 V, VGS = 0 V
Zero Gate Voltage Drain Current
IDSS
VDS = - 20 V, VGS = 0 V
VDS = - 30 V, VGS = 0 V, TJ = 85 °C
VDS = - 20 V, VGS = 0 V, TJ = 85 °C
On-State Drain Currenta
ID(on)
VDS ≥ - 5 V, VGS = - 10 V
VDS ≤ - 5 V, VGS = - 10 V
VGS = - 10 V, ID = - 5.0 A
VGS = - 4.5 V, ID = - 7.0 A
Drain-Source On-State Resistancea
rDS(on)
VGS = - 4.5 V, ID = - 3.7 A
VGS = - 2.5 V, ID = - 6.2 A
VGS = - 1.8 V, ID = - 3 A
Forward Transconductancea
gfs
VDS = - 15 V, ID = - 5.0 A
VDS = - 15 V, ID = - 3 A
Diode Forward Voltagea
VSD
IS = - 1.7 A, VGS = 0 V
IS = - 1.7 A, VGS = 0 V
Dynamicb
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Qg
Channel-1
VDS = - 15 V, VGS = - 10 V, ID = - 5.0 A
Qgs
Channel-2
Qgd
VDS = - 10 V, VGS = - 4.5 V, ID = - 7 A
Turn-On Delay Time
Rise Time
td(on)
tr
Channel-1
VDD = - 15 V, RL = - 15 Ω
ID ≅ - 1 A, VGEN = - 10 V, RG = 6 Ω
Turn-Off Delay Time
Fall Time
td(off)
tf
Channel-2
VDD = - 10 V, RL = 10 Ω
ID ≅ - 1 A, VGEN = - 4.5 V, RG = 6 Ω
Source-Drain Reverse Recovery Time
trr
IF = - 1.7 A, di/dt = 100 A/µs
IF = - 1.7 A, di/dt = 100 A/µs
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Ch-1
Ch-2
Min
- 1.0
- 0.4
- 20
- 20
Typ
Max
-3
-1
± 100
± 100
-1
-1
-5
-5
0.044
0.022
0.082
0.029
0.039
10
25
- 0.80
- 0.80
0.054
0.027
0.100
0.035
0.048
- 1.2
- 1.2
12.5
19
21
25
2.1
2.6
3.5
6.0
7
15
20
30
10
15
40
60
30
45
125
190
22
35
85
130
25
60
64
90
Unit
V
nA
µA
A
Ω
S
V
nC
ns
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 72241
S-61006-Rev. C, 12-Jun-06