SIA918EDJ Datasheet, PDF (1/9 Pages) Vishay Siliconix – Dual N-Channel 30 V (D-S) MOSFET

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SiA918EDJ
Vishay Siliconix
Dual N-Channel 30 V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
30
R_DS(on) () MAX.
0.058 at V_GS = 4.5 V
0.065 at V_GS = 2.5 V
0.077 at V_GS = 1.8 V
I_D (A)
4.5 ^a
4.5 ^a
4.5 ^a
Q_g (TYP.)
3.6 nC
PowerPAK^® SC-70-6L Dual
D₁
G_{2 6}
S_{2 5}
4
D1
D2
1 _2.05 ^mm
Top View
1
2 S₁
3 G₁
D₂
Bottom View
Marking Code: CL
Ordering Information:
SiA918EDJ-T1-GE3 (lead (Pb)-free and halogen free)
FEATURES
• TrenchFET^® power MOSFET
• Thermally enhanced PowerPAK^® SC-70 package
- Small footprint area
- Low on-resistance
• Typical ESD protection: 1000 V (HBM)
• 100 % R_g tested
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Portable devices such as smart phones, tablet PCs and
mobile computing
- Load switch
- DC/DC converter
- Power management
D₁
D₂
G₁
G₂
N-Channel MOSFET S1 N-Channel MOSFET S₂
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current (t = 100 μs)
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
Continuous Source-Drain Diode Current
T_C = 25 °C
T_A = 25 °C
T_C = 25 °C
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) ^d,e
V_DS
V_GS
I_D
I_DM
I_S
P_D
T_J, T_stg
LIMIT
30
±8
4.5 ^a
4.5 ^a
4.4 ^{b, c}
3.5 ^{b, c}
15
4.5 ^a
1.6 ^{b, c}
7.8
5
1.9 ^{b, c}
1.2 ^{b, c}
-55 to +150
260
UNIT
V
A
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t5s
Steady State
R_thJA
R_thJC
52
12.5
65
°C/W
16
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state condition is 110 °C/W.
S16-1004-Rev. A, 30-May-16
1
Document Number: 79034
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000