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SIA778DJ Datasheet, PDF (1/12 Pages) Vishay Siliconix – N-Channel 12 V and 20 V (D-S) MOSFETs
New Product
SiA778DJ
Vishay Siliconix
N-Channel 12 V and 20 V (D-S) MOSFETs
PRODUCT SUMMARY
Channel 1
Channel 2
VDS (V)
12
20
RDS(on) (Ω)
0.029 at VGS = 4.5 V
0.034 at VGS = 2.5 V
0.044 at VGS = 1.8 V
0.065 at VGS = 1.5 V
0.225 at VGS = - 4.5 V
0.270 at VGS = - 2.5 V
0.345 at VGS = - 1.8 V
0.960 at VGS = - 1.5 V
ID (A)
4.5a
4.5a
4.5a
4.5a
1.5a
1.5a
1.5a
0.5a
Qg (Typ.)
5.6 nC
1.1 nC
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFETs
• New Thermally Enhanced PowerPAK®
SC-70 Package
- Small Footprint Area
- Low On-Resistance
• Typical ESD Performance for Channel 2: 2800 V
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• N-Channel Level Shift Load Switch for Portable Devices
- for 0 V to 8 V Power Lines
PowerPAK SC-70-6 Dual
1
S1
D1
D1
6
G2
5
2.05 mm S2
4
2
G1
D2
3
D2
2.05 mm
Marking Code
Part # code
CGX
XXX
Lot Traceability
and Date Code
Ordering Information: SiA778DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
D1
G2
G1
S1
N-Channel 1 MOSFET
D2
200 Ω
S2
N-Channel 2 MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Channel 1
Channel 2
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
12
VGS
±8
20
V
±6
TC = 25 °C
4.5a
1.5a
Continuous Drain Current (TJ = 150 °C)
TC = 70 °C
TA = 25 °C
ID
4.5a
4.5a, b, c
1.5a
1.5b, c
TA = 70 °C
4.5a, b, c
1.5b, c
A
Pulsed Drain Current
IDM
20
4
Source Drain Current Diode Current
TC = 25 °C
TA = 25 °C
IS
4.5a
1.6b, c
1.5a
1.5b, c
TC = 25 °C
6.5
5
Maximum Power Dissipation
TC = 70 °C
TA = 25 °C
PD
5
1.9b, c
3.2
1.9b, c
W
TA = 70 °C
1.2b, c
1.2b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
TJ, Tstg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Channel 1
Channel 2
Parameter
Symbol
Typ. Max. Typ. Max.
Unit
Maximum Junction-to-Ambientb, f
Maximum Junction-to-Case (Drain)
t≤5s
Steady State
RthJA
RthJC
52
65
52
65
12.5
16
20
25
°C/W
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions for channel 1 and channel 2 is 110 °C/W.
Document Number: 65669
S10-0046-Rev. A, 11-Jan-10
www.vishay.com
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