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SI8424DB Datasheet, PDF (1/11 Pages) Vishay Siliconix – N-Channel 1.2-V (G-S) MOSFET
N-Channel 1.2-V (G-S) MOSFET
Si8424DB
Vishay Siliconix
PRODUCT SUMMARY
VDS (V)
RDS(on) (Ω)
0.031 at VGS = 4.5 V
0.033 at VGS = 2.5 V
8
0.035 at VGS = 1.8 V
0.043 at VGS = 1.5 V
0.077 at VGS = 1.2 V
ID (A)a
12.2
11.6
11.2
10.2
1.3
Qg (Typ.)
20 nC
MICRO FOOT
Bump Side View
Backside View
FEATURES
• TrenchFET® Power MOSFET
• Industry First 1.2 V Rated MOSFET
• Ultra Small MICRO FOOT® Chipscale
Packaging Reduces Footprint Area, Profile
RoHS
COMPLIANT
(0.62 mm) and On-Resistance Per Footprint Area
APPLICATIONS
• Low Threshold Load Switch for Portable Devices
- Low Power Consumption
- Increased Battery Life
• Ultra Low Voltage Load Switch
D
3
2
D
D
8424
G
XXX
Device Marking: 8424
xxx = Date/Lot Traceability Code
S
4
G
1
Ordering Information: Si8424DB-T1-E1 (Lead (Pb)-free)
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
8
V
VGS
±5
TC = 25 °C
12.2
Continuous Drain Current (TJ = 150 °C)
TC = 70 °C
TA = 25 °C
ID
9.8
8.1b,c
TA = 70 °C
6.5b,c
A
Pulsed Drain Current
IDM
20
Continuous Source-Drain Diode Current
TC = 25 °C
TA = 25 °C
IS
5.2
2.3b,c
TC = 25 °C
6.25
Maximum Power Dissipation
TC = 70 °C
TA = 25 °C
PD
4
2.78b,c
W
TA = 70 °C
1.78b,c
Operating Junction and Storage Temperature Range
TJ, Tstg
- 55 to 150
°C
Package Reflow Conditionsd
IR/Convection
260
Notes:
a. Based on TC = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Refer to IPC/JEDEC (J-STD-020C), no manual or hand soldering.
e. In this document, any reference to the Case represents the body of the MICRO FOOT device and Foot is the bump.
Document Number: 74400
S-82119-Rev. B, 08-Sep-08
www.vishay.com
1