SI7980DP Datasheet, PDF (1/18 Pages) Vishay Siliconix – Dual N-Channel 20-V (D-S) MOSFET with Schottky Diode

Si7980DP
Vishay Siliconix
Dual N-Channel 20-V (D-S) MOSFET with Schottky Diode
PRODUCT SUMMARY
V_DS
R_DS(on) (Ω)
I_D (A)^{a, f Q}g ^(Typ.)
Channel-1 20 ^{0.022 at VGS = 10 V}
8.0
8
0.025 at V_GS = 4.5 V 8.0
Channel-2 20 ^{0.015 at VGS = 10 V}
8.0
17
0.019 at V_GS = 4.5 V 8.0
SCHOTTKY PRODUCT SUMMARY
V_DS (V)
V_SD (V)
Diode Forward Voltage
20
0.43 V at 1.0 A
I_F (A)^a
4.0
PowerPAK SO-8
FEATURES
• Halogen-free According to IEC 61249-2-21
Available
• TrenchFET^® Power MOSFET
• 100 % R_g and UIS Tested
APPLICATIONS
• Synchronous Buck Converter
- Game Machines
- Notebook Computers
D₁
6.15 mm
D1
8
D1
S 1^{/D 2}
1
G1
5.15 mm
2
S2
3
G2
4
7
S1/D2
S1/D2
6
5
Bottom View
Ordering Information: Si7980DP-T1-E3 (Lead (Pb)-free)
Si7980DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
G₁
N-Channel 1
MOSFET
G₂
N-Channel 2
MOSFET
S₂
S₁/D₂
Schottky Diode
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
Channel-1
Channel-2
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
20
20
V
V_GS
± 16
± 16
T_C = 25 °C
8^f
8^f
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
8^f
8.8^{b, c}
8^f
11^{b, c}
T_A = 70 °C
7.1^{b, c}
9.0^{b, c}
Pulsed Drain Current
I_DM
30
30
A
Source-Drain Current Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
8^f
2.8^{b, c}
8^f
2.8^{b, c}
Pulsed Source-Drain Current
I_SM
30
30
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
L = 0.1 mH
I_AS
E_AS
15
11.2
15
11.2
mJ
T_C = 25 °C
19.8
21.9
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
12.6
3.1^{b, c}
14.0
3.4^{b, c}
W
T_A = 70 °C
2.0^{b, c}
2.2^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
Notes:
a. Based on T_C = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Package limited.
Document Number: 68391
S-83039-Rev. C, 29-Dec-08
www.vishay.com
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