SI7111EDN Datasheet, PDF (1/7 Pages) Vishay Siliconix – P-Channel 30 V (D-S) MOSFET

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Si7111EDN
Vishay Siliconix
P-Channel 30 V (D-S) MOSFET
PowerPAK^® 1212-8 Single
D
D8
D7
D6
5
3.3 _mm
1
Top View
3.3 ^mm
PRODUCT SUMMARY
V_DS (V)
R_DS(on) max. () at V_GS = -4.5 V
R_DS(on) max. () at V_GS = -2.5 V
Q_g typ. (nC)
I_D (A)
Configuration
1
2_S
3_S
4_S
G
Bottom View
-30
0.00855
0.01600
30.5
60 ^{a, g}
Single
FEATURES
• TrenchFET^® Gen III p-channel power MOSFET
• R_DS(on) rating at V_GS = -2.5 V
• 100 % R_g and UIS tested
• Typical ESD protection: 4600 V HBM
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
APPLICATIONS
S
• Battery switch
• Adapter and charger switch
• Load switch
G
• Battery management in mobile
devices
D
P-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK 1212-8
Si7111EDN-T1-GE3
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-source voltage
Gate-source voltage
T_C = 25 °C
Continuous drain current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
Pulsed drain current (t = 100 μs)
Continuous source-drain diode current
T_C = 25 °C
T_A = 25 °C
Single pulse avalanche current
Single pulse avalanche energy
L = 0.1 mH
T_C = 25 °C
Maximum power dissipation
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
Operating junction and storage temperature range
Soldering recommendations (peak temperature) ^c
V_DS
V_GS
I_D
I_DM
I_S
I_AS
E_AS
P_D
T_J, T_stg
LIMIT
-30
± 12
60 ^a
49.3
17.4 ^{a, b}
13.9 ^{a, b}
150
47.3
3.7 ^{a, b}
20
20
52
33.3
4.1 ^{a, b}
2.6 ^{a, b}
-55 to +150
260
UNIT
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum junction-to-ambient ^a
t  xx s
R_thJA
23
Maximum junction-to-case (drain)
Steady state
R_thJF
1.9
30
°C/W
2.4
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 81 °C/W.
g. T_C = 25 °C.
S16-1520-Rev. A, 01-Aug-16
1
Document Number: 67807
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000