SI5999EDU Datasheet, PDF (1/9 Pages) Vishay Siliconix – Dual P-Channel 20 V (D-S) MOSFET

Dual P-Channel 20 V (D-S) MOSFET
Si5999EDU
Vishay Siliconix
PRODUCT SUMMARY
V_DS (V)
R_DS(on) ()
0.059 at V_GS = - 4.5 V
- 20
0.096 at V_GS = - 2.5 V
I_D (A)
- 6^a
- 6^a
Q_g (Typ.)
6.9 nC
PowerPAK ChipFET Dual
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FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET^® Power MOSFET
• New Thermally Enhanced PowerPAK^®
ChipFET^® Package
- Small Footprint Area
- Low On-Resistance
- Thin 0.8 mm Profile
• Typical ESD Performance 1500 V in HBM
• Compliant to RoHS Directive 2002/95/EC
S₁
2
APPLICATIONS
D1
G₁
8
D1
7
D2
6
D2
5
3
S2
4
G2
•
Load Switch and Charger Switch
for Portable Devices
S₁
S₂
• DC/DC Converters
Marking Code
OA XXX
Lot Traceability
and Date Code
G₁
G₂
Bottom View
Part #
Code
D₁
D₂
Ordering Information: Si5999EDU-T1-GE3 (Lead (Pb)-free and Halogen-free)
P-Channel MOSFET P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
- 20
V
V_GS
± 12
T_C = 25 °C
- 6^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
- 6^a
- 5^{b, c}
T_A = 70 °C
- 4^{b, c}
A
Pulsed Drain Current (t = 300 µs)
Continuous Source-Drain Diode Current
I_DM
T_C = 25 °C
T_A = 25 °C
I_S
- 20
- 6^a
- 1.9^{b, c}
Maximum Power Dissipation
T_C = 25 °C
10.4
T_C = 70 °C
T_A = 25 °C
P_D
6.7
2.3^{b, c}
W
T_A = 70 °C
1.5^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t5s
R_thJA
43
Steady State
R_thJC
9.5
55
°C/W
12
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 105 °C/W.
Document Number: 67019
S10-2428-Rev. A, 25-Oct-10
www.vishay.com
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