SI5519DU Datasheet, PDF (1/12 Pages) Vishay Siliconix – N- and P-Channel 20-V (D-S) MOSFET

Si5519DU
Vishay Siliconix
N- and P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
R_DS(on) (Ω)
N-Channel 20
0.036 at V_GS = 4.5 V
0.063 at V_GS = 2.5 V
0.064 at V_GS = - 4.5 V
P-Channel - 20
0.095 at V_GS = - 2.5 V
I_D (A)^{a Q}g ^(Typ.)
6.0
5.4 nC
6.0
- 6.0
- 6.0
6.0 nC
FEATURES
• Halogen-free
• TrenchFET^® Power MOSFETs
APPLICATIONS
• Portable DC-DC Applications
RoHS
COMPLIANT
PowerPAK ChipFET Dual
1
D₁
S₂
S₁
2
D₁
8
D₁
7
6
G₁
D₂
D₂
5
3
S₂
4
G₂
G₁
Marking Code
EB XXX
Lot Traceability
S₁
and Date Code
G₂
D₂
Bottom View
Part #
Code
Ordering Information: Si5519DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
N-Channel
P-Channel
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
20
- 20
V_GS
± 12
V
T_C = 25 °C
6.0^a
- 6.0^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
6.0^a
6.0^{a, b, c}
- 6.0^a
- 4.8^{b, c}
T_A = 70 °C
4.9^{b, c}
- 3.8^{b, c}
A
Pulsed Drain Current
I_DM
25
- 20
Source Drain Current Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
6.0^a
1.9^{b, c}
- 6.0^a
- 1.9^{b, c}
T_C = 25 °C
10.4
10.4
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
6.6
2.27^{b, c}
6.6
2.27^{b, c}
W
T_A = 70 °C
1.45^{b, c}
1.45^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
N-Channel
P-Channel
Parameter
Symbol
Typ. Max. Typ. Max.
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
Steady State
R_thJA
R_thJC
43
55
43
55
9.5
12
9.5
12
°C/W
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Reliability Manual for profile. The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated)
as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to
ensure adequade bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 105 °C/W.
Document Number: 74406
S-81449-Rev. B, 23-Jun-08
www.vishay.com
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