SI5517DU_08 Datasheet, PDF (1/12 Pages) Vishay Siliconix – N- and P-Channel 20-V (D-S) MOSFET

Si5517DU
Vishay Siliconix
N- and P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
N-Channel
P-Channel
V_DS
R_DS(on) (Ω)
0.039 at V_GS = 4.5 V
20 0.045 at V_GS = 2.5 V
0.055 at V_GS = 1.8 V
0.072 at V_GS = - 4.5 V
- 20 0.100 at V_GS = - 2.5 V
0.131 at V_GS = - 18 V
PowerPAK ChipFET Dual
I_D (A)^a
6
6
6
-6
-6
-6
Q_g
6 nc
5.5 nc
1
S1
2
Marking Code
G₁
D1
8
D₁
7
D2
6
D2
EA
3
S₂
4
G2
XXX
Lot Traceability
and Date Code
Part # Code
5
FEATURES
• Halogen-free
• TrenchFET^® Power MOSFETs
• New Thermally Enhanced PowerPAK^®
ChipFET^® Package
- Small Footprint Area
- Low On-Resistance
- Thin 0.8 mm Profile
RoHS
COMPLIANT
APPLICATIONS
• Complementary MOSFET for Portable Devices
- Ideal for Buck-Boost Circuits
D₁
S₂
G₂
G₁
Bottom View
Ordering Information: Si5517DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
S₁
N-Channel MOSFET
D₂
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
N-Channel
P-Channel
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
20
- 20
V
V_GS
±8
T_C = 25 °C
6^a
- 6^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
6^a
7.2^{b, c}
- 6^a
- 4.6^{b, c}
T_A = 70 °C
5.8^{b, c}
- 3.7^{b, c}
A
Pulsed Drain Current
I_DM
20
- 15
Source-Drain Current Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
6.9
1.9^{b, c}
- 6.9
- 1.9^{b, c}
T_C = 25 °C
8.3
8.3
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
5.3
2.3^{b, c}
5.3
2.3^{b, c}
W
T_A = 70 °C
1.5^{b, c}
1.5^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
N-Channel
P-Channel
Parameter
Symbol
Typ. Max. Typ. Max.
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Case (Drain)
t≤5s
Steady State
R_thJA
R_thJC
45
55
45
55
12
15
12
15
°C/W
Notes:
a. Based on T_C = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is
exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be
guaranteed and is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 105 °C/W for both channels.
Document Number: 73529
S-81449-Rev. B, 23-Jun-08
www.vishay.com
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