SI5511DC Datasheet, PDF (1/12 Pages) Vishay Siliconix – N- and P-Channel 30-V (D-S) MOSFET

Si5511DC
Vishay Siliconix
N- and P-Channel 30-V (D-S) MOSFET
PRODUCT SUMMARY
V_DS (V)
r_DS(on) (Ω)
N-Channel 30
0.055 at V_GS = 4.5 V
0.090 at V_GS = 2.5 V
0.150 at V_GS = - 4.5 V
P-Channel - 30
0.256 at V_GS = - 2.5 V
1206-8 Chip-FET ^®
I_D (A)
4^a,g
4^a,g
- 3.6^a
- 2.7^a
Q_g (Typ)
4.2 nC
2.85 nC
FEATURES
• TrenchFET^® Power MOSFETs
APPLICATIONS
• Buck-Boost
- DSC
- Portable Devices
RoHS
COMPLIANT
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S₁
D₁
D₁
G₁
S₂
D₂
G₂
D₂
Marking Code
EE XXX
Lot Traceability
and Date Code
Part # Code
Bottom View
Ordering Information: Si5511DC-T1-E3 (Lead (Pb)-free)
D₁
G₁
S₂
G₂
S₁
N-Channel MOSFET
D₂
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T_A = 25 °C, unless otherwise noted
Parameter
Symbol
N-Channel
P-Channel
Unit
Drain-Source Voltage
Gate-Source Voltage
V_DS
30
- 30
V_GS
± 12
V
T_C = 25 °C
4^{a, g}
- 3.6^a
Continuous Drain Current (T_J = 150 °C)
T_C = 70 °C
T_A = 25 °C
I_D
4^{a, g}
4^{a, g}
- 2.8^a
- 2.3^{b, c}
T_A = 70 °C
3.9^a
- 1.8^{b, c}
A
Pulsed Drain Current
I_DM
15
- 10
Source Drain Current Diode Current
T_C = 25 °C
T_A = 25 °C
I_S
2.6
1.7^{b, c}
- 2.6
- 1.7^{b, c}
T_C = 25 °C
3.1
2.6
Maximum Power Dissipation
T_C = 70 °C
T_A = 25 °C
P_D
2.0
2.1^{b, c}
1.7
1.3^{b, c}
W
T_A = 70 °C
1.33^{b, c}
0.84^{b, c}
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)^{d, e}
T_J, T_stg
- 55 to 150
°C
260
THERMAL RESISTANCE RATINGS
N-Channel
P-Channel
Parameter
Symbol
Typ Max Typ Max
Unit
Maximum Junction-to-Ambient^{b, f}
Maximum Junction-to-Foot (Drain)
t≤5s
Steady State
R_thJA
R_thJF
50
60
77
95
30
40
33
40
°C/W
Notes:
a. Based on T_C = 25 °C.
b. Surface Mounted on 1" x 1" FR4 Board.
c. t = 5 s
d. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result
of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequade
bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 110 °C/W for N-Channel and 130 °C/W for P-Channel.
g. Package limited.
Document Number: 73787
S-72204-Rev. B, 22-Oct-07
www.vishay.com
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