V23990-K229-A-PM Datasheet, PDF (9/18 Pages) Vincotech – Solderless interconnection

V23990-K229-A-PM
T1,T2,T3,T4,T5,T6,T7 / D1,D2,D3,D4,D5,D6,D7
Figure 21
Power dissipation as a
function of heatsink temperature
P_tot = f(T_h)
180
150
120
90
60
30
0
0
At
T_j =
30
60
150
°C
Figure 23
Power dissipation as a
function of heatsink temperature
P_tot = f(T_h)
100
T1,T2,T3,T4,T5,T6,T7 IGBT
Figure 22
Collector current as a
function of heatsink temperature
I_C = f(T_h)
50
40
30
20
10
0
90
120 T h ( ^o C)
150
0
30
60
At
T_j =
150
°C
V_GE =
15
V
D1,D2,D3,D4,D5,D6,D7 FWD
Figure 24
Forward current as a
function of heatsink temperature
I_F = f(T_h)
40
T1,T2,T3,T4,T5,T6,T7 IGBT
90
120 T h ( ^o C) 150
D1,D2,D3,D4,D5,D6,D7 FWD
80
30
60
20
40
10
20
0
0
At
T_j =
30
150
60
°C
0
90
120
T h ( ^o C) 150
0
30
60
At
T_j =
150
°C
90
120 T h ( ^o C) 150
copyright Vincotech
9
Revision: 3.1