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| V23990-K229-A-PM Datasheet, PDF (8/18 Pages) Vincotech – Solderless interconnection | |||
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V23990-K229-A-PM
T1,T2,T3,T4,T5,T6,T7 / D1,D2,D3,D4,D5,D6,D7
Figure 17
Typical rate of fall of forward
and reverse recovery current as a
function of collector current
dI0/dt,dIrec/dt = f(IC)
1400
1200
dI0/dt
dIrec/dt
1000
800
600
400
200
0
0
10
20
At
Tj =
125
°C
VCE =
600
V
VGE =
±15
V
Rgon =
36
â¦
D1,D2,D3,D4,D5,D6,D7 FWD
di0/dtHigh T
dIrec/dtHigh T
30
40
I C (A) 50
Figure 18
Typical rate of fall of forward
and reverse recovery current as a
function of IGBT turn on gate resistor
dI0/dt,dIrec/dt = f(Rgon)
1400
1200
D1,D2,D3,D4,D5,D6,D7 FWD
dI0/dt
dIrec/dt
1000
di0/dtHigh T
800
600
dIrec/dtHigh T
400
200
0
0
20
40
At
Tj =
125
°C
VR =
600
V
IF =
25
A
VGE =
±15
V
60
R gon ( ⦠)
80
Figure 19
IGBT transient thermal impedance
as a function of pulse width
ZthJH = f(tp)
101
T1,T2,T3,T4,T5,T6,T7 IGBT
Figure 20
FWD transient thermal impedance
as a function of pulse width
ZthJH = f(tp)
101
D1,D2,D3,D4,D5,D6,D7 FWD
100
100
10-1
10-2
10-5
10-4
10-3
10-2
10-1
At
D=
RthJH =
tp / T
0,90
K/W
IGBT thermal model values
Thermal grease
R (C/W) Tau (s)
0,04
1,3E+01
0,11
1,1E+00
0,38
1,6E-01
0,25
4,3E-02
0,08
5,7E-03
0,04
3,7E-04
D = 0,5
0,2
0,1
0,05
0,02
0,01
0,005
0.000
100 t p (s)
10110
10-1
10-2
10-5
10-4
10-3
10-2
10-1
At
D=
RthJH =
tp / T
1,7
K/W
FWD thermal model values
Thermal grease
R (C/W) Tau (s)
0,09
2,0E+00
0,60
2,1E-01
0,61
5,6E-02
0,26
8,0E-03
0,15
8,1E-04
D = 0,5
0,2
0,1
0,05
0,02
0,01
0,005
0.000
100
t p (s) 10110
copyright Vincotech
8
Revision: 3.1
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