B048K120T30 Datasheet, PDF (8/15 Pages) Vicor Corporation – VI Chip - BCM Bus Converter Module

Mechanical Drawings
PRELIMINARY
V•I Chip Voltage Transformation Module
SOLDER BALL
#A1 INDICATOR
21,5
0.85
32,0
1.26
1,00
0.039
5,9
0.23
(106) X
Ø
0.020
0.51
SOLDER BALL
1,00 _TYP
0.039
28,8
1.13
16,0
0.63
18,00
0.709
9,00
0.354
1,00
0.039
SOLDER BALL #A1
30,00
1.181
CL
15,00
0.591
TOP VIEW (COMPONENT SIDE)
1,6
CL
1,00
0.06
BOTTOM VIEW
0.039
3,9
0.15
15,6
0.62
SEATING PLANE
Figure 15— BCM BGA mechanical outline; Inboard mounting
NOTES:
mm
1- DIMENSIONS ARE inch .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
3- PRODUCT MARKING ON TOP SURFACE
IN-BOARD MOUNTING
BGA surface mounting requires a
cutout in the PCB in which to recess the V•I Chip
(
ø
0,51
0.020
)
SOLDER MASK
DEFINED PADS
0,50
0.020
1,50
0.059
( _01.,00309)
ø
0,53
0.021
PLATED
VIA
CONNECT TO
INNER LAYERS
0,50
0.020
1,00
0.039
SOLDER PAD #A1
18,00
0.709
9,00
0.354
(2)
X
10,00
0.394
1,00
0.039
1
(4)
X
6,00
0.236
20,00
0.787 _17,00
0.669
15,00
0.591
13,00
0.512
(106) X
ø
0,51
0.020
SOLDER MASK
DEFINED PAD
PCB CUTOUT
8,08
0.318
16,16
0.636
24,00
0.945
16,00
0.630
8,00
0.315
29,26
1.152
31
0,37
0.015
(4) X R
1,6
0.06
Figure 16—BCM BGA PCB land/VIA layout information; Inboard mounting
1,00
0.039
(01.,00309)
RECOMMENDED LAND AND VIA PATTERN
(COMPONENT SIDE SHOWN)
NOTES:
mm
1- DIMENSIONS ARE inch .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
vicorpower.com 800-735-6200
V•I Chip Bus Converter Module
B048K120T30
Rev. 1.0
Page 8 of 16