B048K120T30 Datasheet, PDF (10/15 Pages) Vicor Corporation – VI Chip - BCM Bus Converter Module

Configuration Options
PRELIMINARY
V•I Chip Voltage Transformation Module
Configuration
Effective power density
Junction-Board
thermal resistance
Junction-Case
thermal resistance
Junction-Ambient
thermal resistance 300LFM
Inboard⁽¹⁾
(Package K)
1750 W/in³
2.1 °C/W
1.1 °C/W
6.5 °C/W
Notes:
(1) Surface mounted to a 2" x 2" FR4 board, 4 layers 2 oz Cu
(2) Pin Fin heat sink available as a separate item
21.5
0.85
Onboard⁽¹⁾
(Package F)
1090 W/in³
2.4 °C/W
1.1 °C/W
6.8 °C/W
Inboard with 0.25"
Pin Fins⁽²⁾
680 W/in³
2.1 °C/W
N/A
Onboard with 0.25"
Pin Fins⁽²⁾
550 W/in³
2.4 °C/W
N/A
5.0 °C/W
5.0 °C/W
22.0
0.87
32.0
32.0
1.26
1.26
4.0
6.3
0.16
0.25
INBOARD MOUNT
(V•I Chip recessed into PCB)
mm
in
ONBOARD MOUNT
mm
in
Figure 19—Inboard mounting – package K
Figure 20— Onboard mounting – package F
F1
15 A
Fuse
C1
47 µF
electrolytic
Input reflected ripple
measurement point
Enable/Disable Switch
R2
2K Ω
SW1 ^D1
+Out
+In
-Out
TM
RSV
BCM
PC
+Out
K
Ro -In
-Out
R3
10 mΩ
typ.
+
Load
C3
10 µF
–
Figure 21—BCM test circuit
Notes:
Source inductance should be no more than 200 nH. If source inductance is
greater than 200 nH, additional bypass capacitance may be required.
C3 should be placed close to the load.
R3 may be ESR of C3 or a seperate damping resistor.
D1 power good indicator will dim when a module fault is detected.
vicorpower.com 800-735-6200
V•I Chip Bus Converter Module
B048K120T30
Rev. 1.0
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