B048K120T30 Datasheet, PDF (6/15 Pages) Vicor Corporation – VI Chip - BCM Bus Converter Module

Specifications (continued)
PRELIMINARY
Thermal
Symbol
RθJC
RθJB
RθJA
RθJA
Parameter
Over temperature shutdown
Thermal capacity
Junction-to-case thermal impedance
Junction-to-BGA thermal impedance
Junction-to-ambient ⁽¹⁾
Junction-to-ambient ⁽²⁾
Min
125
Typ
Max
130
135
0.61
1.1
1.5
2.1
2.5
6.5
7.2
5.0
5.5
Unit
°C
Ws/°C
°C/W
°C/W
°C/W
°C/W
Notes:
(1 B048K120T30 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
(2) B048K120T30 with optional 0.25"H Pin Fins surface mounted on FR4 board, 300 LFM.
V•I Chip Voltage Transformation Module
Note
Junction temperature
BGA package
V•I Chip Stress Driven Product Qualification Process
Test
High Temperature Operational Life (HTOL)
Temperature cycling
High temperature storage
Moisture resistance
Temperature Humidity Bias Testing (THB)
Pressure cooker testing (Autoclave)
Highly Accelerated Stress Testing (HAST)
Solvent resistance/marking permanency
Mechanical vibration
Mechanical shock
Electro static discharge testing – human body model
Electro static discharge testing – machine model
Highly Accelerated Life Testing (HALT)
Dynamic cycling
Standard
JESD22-A-108-B
JESD22-A-104B
JESD22-A-103A
JESD22-A113-B
EIA/JESD22-A-101-B
JESD22-A-102-C
JESD22-A-110B
JESD22-B-107-A
JESD22-B-103-A
JESD22-B-104-A
EIA/JESD22-A114-A
EIA/JESD22-A115-A
Per Vicor Internal
Test Specification⁽¹⁾
Per Vicor internal
test specification⁽¹⁾
Note:
(1) For details of the test protocols see Vicor’s website.
Environment
125°C, Vmax, 1,008 hrs
-55°C to 125°C, 1,000 cycles
150°C, 1,000 hrs
Moisture sensitivity Level 5
85°C, 85% RH, Vmax, 1,008 hrs
121°C, 100% RH, 15 PSIG, 96 hrs
130°C, 85% RH, Vmax, 96 hrs
Solvents A, B & C as defined
20g peak, 20-2,000 Hz, test in X, Y & Z directions
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Meets or exceeds 2,000 Volts
Meets or exceeds 200 Volts
Operation limits verified, destruct margin determined
Constant line, 0-100% load, -20°C to 125°C
V•I Chip Ball Grid Array Interconnect Qualification
Test
BGA solder fatigue evaluation
Solder ball shear test
Standard
IPC-9701
IPC-SM-785
IPC-9701
Environment
Cycle condition: TC3 (-40 to +125°C)
Test duration: NTC-B (500 failure free cycles)
Failure through bulk solder or copper pad lift-off
vicorpower.com 800-735-6200
V•I Chip Bus Converter Module
B048K120T30
Rev. 1.0
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