B048K120T30 Datasheet, PDF (11/15 Pages) Vicor Corporation – VI Chip - BCM Bus Converter Module

Application Note
PRELIMINARY
V•I Chip Voltage Transformation Module
Parallel Operation
The BCM will inherently current share when properly configured in an
array of BCMs. Arrays may be used for higher power or redundancy in
an application.
Current sharing accuracy is maximized when the source and load
impedance presented to each BCM within an array are equal.
The recommended method to achieve matched impedances is to
dedicate common copper planes within the PCB to deliver and return the
current to the array, rather than rely upon traces of varying lengths. In
typical applications the current being delivered to the load is larger than
that sourced from the input, allowing traces to be utilized on the input
side if necessary. The use of dedicated power planes is, however,
preferable.
The BCM power train and control architecture allow bi-directional power
transfer, including reverse power processing from the BCM output to its
input. Reverse power transfer is enabled if the BCM input is within its
operating range and the BCM is otherwise enabled. The BCM’s ability to
process power in reverse improves the BCM transient response to an
output load dump.
Thermal Management
The high efficiency of the V•I Chip results in relatively low power
dissipation and correspondingly low generation of heat. The heat
generated within internal semiconductor junctions is coupled with low
effective thermal resistances, RθJC and RθJB, to the V•I Chip case and its
Ball Grid Array allowing thermal management flexibility to adapt to
specific application requirements (Figure 22).
CASE 1 Convection via optional Pin Fins to air.
If the application is in a typical environment with forced convection over
the surface of the PCB and greater than 0.4" headroom, a simple
thermal management strategy is to procure V•I Chips with the Pin Fin
option. The total Junction-to-Ambient thermal resistance, RθJA, of a
surface mounted V•I Chip with optional 0.25" Pin Fins is 4.8 °C/W in
300 LFM air flow (Figure 24). At full rated output power of 300 W, the
heat generated by the BCM is approximately 13 W (Figure 6). Therefore,
the junction temperature rise to ambient is approximately 62°C. Given a
maximum junction temperature of 125°C, a temperature rise of 62°C
allows the V•I Chip to operate at rated output power at up to 63°C
ambient temperature. At 100 W of output power, operating ambient
temperature extends to 103°C.
Figure 22—Thermal resistance
θJC = 1.1°C/W
θJB = 2.1°C/W
CASE 2—Conduction to the PCB
The low thermal resistance Junction-to-BGA, RθJB, allows use of the PCB
to exchange heat from the V•I Chip, including convection from the PCB
to the ambient or conduction to a cold plate.
For example, with a V•I Chip surface mounted on a 2" x 2" area of a
multi-layer PCB, with an aggregate 8 oz of effective copper weight, the
total Junction-to-Ambient thermal resistance, RθJA, is 6.5°C/W in 300
LFM air flow (see Thermal Resistance section, Page 1). Given a maximum
junction temperature of 125°C and 13 W dissipation at 300 W of output
power, a temperature rise of 85°C allows the V•I Chip to operate at
rated output power at up to 41°C ambient temperature.
300
0
-40
-20 0
20 40 60 80 100 120 140
Operating Junction Temperature
Figure 23— Thermal derating curve
BCM with 0.25'' optional Pin Fins
10
9
8
7
6
5
4
3
0
100
200
300
400
500
600
Airflow (LFM)
Figure 24—Junction-to-ambient thermal resistance of BCM with 0.25"
Pin Fins (Pin Fins available as a separate item.)
vicorpower.com 800-735-6200
V•I Chip Bus Converter Module
B048K120T30
Rev. 1.0
Page 11 of 16