V048K015T80 Datasheet, PDF (6/20 Pages) Vicor Corporation – VI Chip - VTM Voltage Transformation Module

Specifications, continued
THERMAL
PRELIMINARY
Symbol Parameter
Min
Over temperature shutdown
125
Thermal capacity
RθJC
Junction-to-case thermal impedance
RθJB
Junction-to-BGA thermal impedance
RθJA
Junction-to-ambient ¹
RθJA
Junction-to-ambient ²
Typ
Max
130
135
0.61
1.1
2.1
6.5
5.0
Unit
°C
Ws/°C
°C/W
°C/W
°C/W
°C/W
Notes
1. V048K015T80 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
2. V048L015T80 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.
Note
Junction temperature
V•I CHIP STRESS DRIVEN PRODUCT QUALIFICATION PROCESS
Test
High Temperature Operational Life (HTOL)
Temperature cycling
High temperature storage
Moisture resistance
Temperature Humidity Bias Testing (THB)
Pressure cooker testing (Autoclave)
Highly Accelerated Stress Testing (HAST)
Solvent resistance/marking permanency
Mechanical vibration
Mechanical shock
Electro static discharge testing – human body model
Electro static discharge testing – machine model
Highly Accelerated Life Testing (HALT)
Dynamic cycling
Standard
JESD22-A-108-B
JESD22-A-104B
JESD22-A-103A
JESD22-A113-B
EIA/JESD22-A-101-B
JESD22-A-102-C
JESD22-A-110B
JESD22-B-107-A
JESD22-B-103-A
JESD22-B-104-A
EIA/JESD22-A114-A
EIA/JESD22-A115-A
Per Vicor Internal
Test Specification
Per Vicor internal
test specification
Environment
125°C, Vmax, 1,008 hrs
-55°C to 125°C, 1,000 cycles
150°C, 1,000 hrs
Moisture sensitivity Level 4
85°C, 85% RH, Vmax, 1,008 hrs
121°C, 100% RH, 15 PSIG, 96 hrs
130°C, 85% RH, Vmax, 96 hrs
Solvents A, B & C as defined
20g peak, 20-2,000 Hz, test in X, Y & Z directions
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Meets or exceeds 2,000 Volts
Meets or exceeds 200 Volts
Operation limits verified, destruct margin determined
Constant line, 0-100% load, -20°C to 125°C
V•I CHIP BALL GRID ARRAY INTERCONNECT QUALIFICATION
Test
BGA Daisy-Chain thermal cycling
Ball shear
Bend test
Standard
IPC-SM-785
IPC-9701
IPC-9701
IPC J-STD-029
IPC J-STD-029
Environment
TC3, -40 to 125°C at <10 °C/min,
10 min dwell time
No failure through intermetallic
Deflection through 4 mm
45 ^{Vicor Corporation Tel: [phone] vicorpower.com}
V•I Chip Voltage Transformation Module Rev. 1.6
Page 6 of 20