V048K015T80 Datasheet, PDF (11/20 Pages) Vicor Corporation – VI Chip - VTM Voltage Transformation Module

Configuration Options (Cont.)
PRELIMINARY
21.5
0.85
22.0
0.87
32.0
32.0
1.26
1.26
11.7
0.46
IN–BOARD MOUNT
with 0.25'' Pin Fins
(V•I Chip recessed into PCB)
Figure 22— In-board with Pin Fins – package L
14.0
0.56
ON–BOARD MOUNT
with 0.25'' Pin Fins
mm
mm
in
in
Figure 23— On-board with Pin Fins – package G
F1
7A
Fuse
C1
100 µF
Al electrolytic
Input reflected ripple
measurement point
C2
0.47 µF
ceramic
Enable/Disable Switch
R2
2K Ω
SW1 ^D1
+In
+Out
PC
SG VTM
TM
–In
–Out
C3
100 µF
+
Load
–
Notes:
+
Temperature Monitor
–
C3 should be placed close to the load.
D1 power good indicator will dim when a module fault is detected.
TM should always be referenced to SG.
Figure 24—VTM test circuit
Application Note
Parallel Operation
In applications requiring higher current or redundancy, VTMs
can be operated in parallel without adding control circuitry or
signal lines. To maximize current sharing accuracy, it is
imperative that the source and load impedance on each VTM in
a parallel array be equal.
To achieve matched impedances, dedicated power planes
within the PC board should be used for the output and output
return paths to the array of paralleled VTMs. This technique is
preferable to using traces of varying size and length.
The VTM power train and control architecture allow bi-directional
power transfer when the VTM is operating within its specified
ranges. Bi-directional power processing improves transient
response in the event of an output load dump. The VTM may
operate in reverse, returning output power back to the input
source. It does so efficiently.
45 ^{Vicor Corporation Tel: [phone] vicorpower.com}
V•I Chip Voltage Transformation Module Rev. 1.6
Page 11 of 20