V048K015T80 Datasheet, PDF (16/20 Pages) Vicor Corporation – VI Chip - VTM Voltage Transformation Module

Application Note (continued)
PRELIMINARY
V•I Chip Handling and Solderability
The product should remain in its package in a dry environment
until ready for use.
The following table shows the soldering requirements for both
the BGA in-board surface mount package and the J-lead
on-board surface mount package.
The reflow process should use industry standard Surface Mount
Technology (SMT) conditions. The exact conditions will
depend upon the solder paste manufacturer’s recommendations.
Under no circumstance should the case temperature exceed
208°C. Refer to Fig.32 for a suggested thermal profile.
Solder Paste
Stencil Thickness
Stencil Aperture
Placement
Acceleration Rate
BGA Package
63/37 "No Clean"*
4-6 mil
20 mil; 1:1 ratio
Within 50% of pad center
<500 in/sec²
J-Lead Package
63/37 "No Clean"
4-6 mil
0.8-0.9:1 ratio
± 5 mil
<500 in/sec²
*Halide free water washable 63/37 Flux paste can be used for the BGA version
package only. Please consult our Application Engineers for further information.
Figure 32—Thermal profile diagram
45 ^{Vicor Corporation Tel: [phone] vicorpower.com}
V•I Chip Voltage Transformation Module Rev. 1.6
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