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SSM3K324R Datasheet, PDF (1/6 Pages) Toshiba Semiconductor – TOSHIBA Field-Effect Transistor Silicon N-Channel MOS Type
SSM3K324R
TOSHIBA Field-Effect Transistor Silicon N-Channel MOS Type
SSM3K324R
○ Power Management Switch Applications
○ DC-DC Converter
Unit: mm
• 1.8V drive
• Low ON-resistance: RDS(ON) = 56 mΩ (max) (@VGS = 4.5 V)
: RDS(ON) = 72 mΩ (max) (@VGS = 2.5 V)
: RDS(ON) = 109 mΩ (max) (@VGS = 1.8 V)
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Drain-source voltage
VDSS
30
V
Gate-source voltage
VGSS
±12
V
Drain current
DC
ID(Note 1)
4.0
A
Pulse
IDP(Note 1,2)
10
Power dissipation
Channel temperature
Storage temperature range
PD (Note 3)
1
W
t ≦ 10s
2
Tch
150
°C
Tstg
−55 to 150
°C
SOT-23F
JEDEC
1. Gate
2. Source
3. Drain
―
Note: Using continuously under heavy loads (e.g. the application of high
JEITA
―
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
TOSHIBA
2-3Z1A
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
Weight: 11 mg (typ.)
absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: The channel temperature should not exceed 150°C during use.
Note 2: PW≦10ms,Duty≦1％
Note 3: Mounted on a FR4 board.
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm2)
Marking
3
Equivalent Circuit (top view)
3
KFD
1
2
1
2
Handling Precaution
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is
protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that
come into direct contact with devices should be made of antistatic materials.
Thermal resistance Rth (ch-a) and power dissipation PD vary depending on board material, board area, board thickness
and pad area. When using this device, please take heat dissipation into consideration.
1
2012-12-21
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