TLC5955 Datasheet, PDF (7/53 Pages) Texas Instruments – TLC5955 48-Channel, 16-Bit, PWM LED Driver with DC, BC, LED Open-Short Detection, and Internal Current Setting

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TLC5955
SBVS237 – MARCH 2014
6.3 Recommended Operating Conditions
PARAMETER
DC CHARACTERISTICS
V_CC
Supply voltage
V_O
Voltage applied to output
V_IH
High-level input voltage
V_IL
Low-level input voltage
I_OH
High-level output current
I_OL
Low-level output current
I_OLC
Constant output sink current
T_A
Operating free-air temperature
range
T_J
Operating junction temperature
range
AC CHARACTERISTICS
f_{CLK (SCLK)}
f_{CLK (GSCLK)}
t_WH0
t_WL0
t_WH1
t_WL1
t_WH2
t_SU0
Data shift clock frequency
Grayscale control clock frequency
Pulse duration
t_SU1
Setup time
t_SU2
t_SU3
t_H0
Hold time
t_H1
TEST CONDITIONS
MIN
OUTX0 to OUTX15⁽¹⁾
SIN, SCLK, LAT, GSCLK
SIN, SCLK, LAT, GSCLK
SOUT
SOUT
OUTX0 to OUTX15⁽¹⁾, 3 V ≤ V_CC ≤ 3.6 V
OUTX0 to OUTX15⁽¹⁾, 3.6 V < V_CC ≤ 5.5 V
3.0
0.7 × V_CC
GND
–40
–40
SCLK
GSCLK
SCLK
10
SCLK
10
GSCLK
10
GSCLK
10
LAT
30
SIN to SCLK↑
5
LAT↓ to SCLK↑ (auto data refresh is
disabled ⁽²⁾)
30
LAT↑ for GS data written to GSCLK↑ when
display time reset mode is disabled
50
LAT↑ for GS data written to GSCLK↑ when
display time reset mode is enabled
70
SCLK↑ to SIN
2
SCLK↑ to LAT↑
5
NOM
MAX UNIT
5.5 V
10 V
V_CC
V
0.3 × V_CC
V
–2 mA
2 mA
23.9 mA
31.9 mA
+85 °C
+125 °C
25 MHz
33 MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
(1) X = R, G, or B.
(2) When auto data refresh is enabled, the first SCLK rising edge after the LAT signal input must be input after the first GSCLK is input.
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DCA (HTSSOP) RTQ (QFN)
56 TERMINALS 56 TERMINALS
UNIT
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
32.2
27.9
16.8
14.9
16.1
6.5
°C/W
0.8
0.3
16.0
6.4
0.9
2.0
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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