English
Language : 

SN74CBTU4411_16 Datasheet, PDF (7/21 Pages) Texas Instruments – Multiplexer/Demultiplexer
www.ti.com
SN74CBTU4411
SCDS192A – APRIL 2005 – REVISED FEBRUARY 2016
6.4 Thermal Information
THERMAL METRIC(1)
SN74CBTU4411
ZST (NFBGA)
UNIT
72 PINS
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
97
°C/W
34.4
°C/W
67.2
°C/W
2
°C/W
69.1
°C/W
—
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
Minimum and maximum limits apply for TA = 0°C to 85°C (unless otherwise noted). Typical limits apply for VDD = 1.8 V and
TA = 25°C (unless otherwise noted).(1)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
VIK (2)
Control inputs(3) VDD = 1.7 V, IIN = –18 mA
–1.8 V
VBIAS_DQS D10
VDD = 1.7 V, DQS_EN = VDD
1.1
1.275 V
VOH
IIN
IOZ (4)
D10
Control inputs(3)
VDD = 1.7 V, DQS_EN = VDD, EN = VDD, IO = 100 µA
VDD = 1.9 V, VIN = VDD or GND
VDD = 1.9 V, VO = 0 to 1.9 V, VI = 0, Switch OFF, VBIAS open
1.6
1.8 V
±1 µA
±10 µA
ICC
VDD = 1.9 V, TC = GND, EN = GND, II/O = 0, S0 or S1 input
switching at 50% duty cycles, Data I/O are open
0.7
2.5 mA
EN = VDD
500 µA
ICCD
VDD = 1.9 V, TC = GND, EN = GND, II/O = 0, S0 or S1 input
switching at 50% duty cycle, Data I/O are open
0.5
mA/
MHz (5)
S port
VDD = 1.9 V, TC = GND, EN = GND, VIN = VREF ± 250 mV
Cin
EN, TC,
DQS_EN inputs
VDD = 1.9 V, VIN = 0 or 1.9 V
2.5
3.5
pF
2.5
Cio(OFF)
Cio(ON)
ron (6)
Δron(flat) (7)
rterm
rpulldown
rpullup
H port
S port
D0–D10
D10
D10
VI/O = 0.5 × VDD ± 0.4 V, Switch OFF, VBIAS open
VI/O = 0.5 × VDD ± 0.4 V, Switch ON, VBIAS = GND
VDD = 1.7 V, VI = 0.5 × VDD ± 0.5 V, IO = 10 mA
VDD = 1.7 V, DQS_EN = VDD,
IO = 10 mA
VI = 0.5 VDD ± 0.25 V
VI = 0.5 VDD ± 0.5 V
VDD = 1.7 V
VDD = 1.7 V
DQS_EN = GND
DQS_EN = VDD, EN = GND
VDD = 1.7 V, DQS_EN = VDD, EN = GND
6
110
280
1600
700
10
1.5
2.5
160
400
2300
1000
2.5 pF
4.6 pF
17 Ω
3
Ω
5
210 Ω
520
Ω
3000
1300 Ω
(1) VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
(2) VIK refers to the clamp voltage due to the internal diode, which is connected from each control input to GND.
(3) For the leakage current test on S0 and S1, EN and TC inputs are set to low.
(4) For I/O ports, the parameter IOZ includes the input leakage current. IOZ applies only to the H port.
(5) This frequency of S0 and S1 inputs, for example, for a data I/O rate of 533 Mbit/s, with a burst of 4, the required frequency is for S0 or
S1 input is ≅ 66 MHz (533/8). The total ICC due to switching S0, S1 will be approximately 27 mA (66 MHz × 0.4 mA/MHz).
(6) Measured by the voltage drop between the D and H pins at the indicated current through the switch. ON-state resistance is determined
by the lower of the voltages of the two (D or H) pins.
(7) Δron(flat) is the difference of maximum ron and minimum ron for a specific channel in a specific device.
Copyright © 2005–2016, Texas Instruments Incorporated
Product Folder Links: SN74CBTU4411
Submit Documentation Feedback
7