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SN74CBTU4411_16 Datasheet, PDF (6/21 Pages) Texas Instruments – Multiplexer/Demultiplexer
SN74CBTU4411
SCDS192A – APRIL 2005 – REVISED FEBRUARY 2016
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
VDD
Supply voltage
VIN
Control input voltage(2)(3)
VI/O
Switch I/O voltage(2)(3)(4)
IIK
Control input clamp current
II/OK
I/O port clamp current
II/O
ON-state switch current(5)
Continuous current through VDD or GND pins
TJ
Junction temperature
Tstg
Storage temperature
VIN < 0 or VIN > 0
VI/O < 0 or VI/O > 0
MIN
MAX
UNIT
–0.5
2.5
V
–0.5
2.5
V
–0.5
2.5
V
±50
mA
±50
mA
±100
mA
±100
mA
150
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VI and VO are used to denote specific conditions for VI/O.
(5) II and IO are used to denote specific conditions for II/O.
6.2 ESD Ratings
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
VALUE
±2500
±750
UNIT
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
VDD
VREF
VBIAS
VIH
VIL
VI/O
TA
Supply voltage
Reference supply voltage
BIAS supply voltage
High-level control input voltage
Low-level control input voltage
Data input/output voltage
Operating free-air temperature
S
EN, TX, DQS_EN
S
EN, TX, DQS_EN
MIN
1.7
0.49 × VDD
0
VREF + 250 mV
0.65 × VDD
0
0
NOM
1.8
0.5 × VDD
0.3 × VDD
MAX
1.9
0.51 × VDD
0.33 × VDD
UNIT
V
V
V
V
VREF – 250 mV
V
0.35 × VDD
VDD
V
85 °C
(1) All unused control inputs of the device must be held at VDD or GND to ensure proper device operation. See the TI application report,
Implications of Slow or Floating CMOS Inputs (SCBA004).
6
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