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DRV8412_11 Datasheet, PDF (7/31 Pages) Texas Instruments – Dual Full Bridge PWM Motor Driver
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DRV8412
DRV8432
SLES242D – DECEMBER 2009 – REVISED JULY 2011
ELECTRICAL CHARACTERISTICS
TA = 25 °C, PVDD = 50 V, GVDD = VDD = 12 V, fSw = 400 kHz, unless otherwise noted. All performance is in accordance
with recommended operating conditions unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN TYP MAX UNIT
Internal Voltage Regulator and Current Consumption
VREG
IVDD
Voltage regulator, only used as a reference node
VDD supply current
VDD = 12 V
Idle, reset mode
Operating, 50% duty cycle
2.95 3.3 3.65 V
9 12 mA
10.5
IGVDD_X
Gate supply current per half-bridge
Reset mode
Operating, 50% duty cycle
1.7 2.5 mA
8
IPVDD_X
Output Stage
Half-bridge X (A, B, C, or D) idle current
Reset mode
0.7
1 mA
RDS(on)
MOSFET drain-to-source resistance, low side (LS)
MOSFET drain-to-source resistance, high side (HS)
TJ = 25°C, GVDD = 12 V, Includes metallization
bond wire and pin resistance
TJ = 25°C, GVDD = 12 V, Includes metallization
bond wire and pin resistance
110
mΩ
110
mΩ
VF
tR
tF
tPD_ON
tPD_OFF
tDT
I/O Protection
Diode forward voltage drop
Output rise time
Output fall time
Propagation delay when FET is on
Propagation delay when FET is off
Dead time between HS and LS FETs
TJ = 25°C - 125°C, IO = 5 A
Resistive load, IO = 5 A
Resistive load, IO = 5 A
Resistive load, IO = 5 A
Resistive load, IO = 5 A
Resistive load, IO = 5 A
1
V
14
nS
14
nS
38
nS
38
nS
5.5
nS
Vuvp,G
Vuvp,hyst (1)
OTW (1)
OTWhyst (1)
OTSD (1)
Gate supply voltage GVDD_X undervoltage
protection threshold
Hysteresis for gate supply undervoltage event
Overtemperature warning
Hysteresis temperature to reset OTW event
Overtemperature shut down
8.5
V
0.8
V
115 125 135 °C
25
°C
150
°C
OTE-
OTWdifferential (1)
OTSDHYST (1)
OTE-OTW overtemperature detect temperature
difference
Hysteresis temperature for FAULT to be released
following an OTSD event
25
°C
25
°C
IOC
Overcurrent limit protection
IOCT
Overcurrent response time
Resistor—programmable, nominal, ROCP = 27 kΩ
Time from application of short condition to Hi-Z of
affected FET(s)
9.7
A
250
ns
RPD
Internal pulldown resistor at the output of each
half-bridge
Connected when RESET_AB or RESET_CD is
active to provide bootstrap capacitor charge
1
kΩ
Static Digital Specifications
VIH
High-level input voltage
VIH
High-level input voltage
VIL
Low-level input voltage
PWM_A, PWM_B, PWM_C, PWM_D, M1, M2, M3
2
RESET_AB, RESET_CD
2
PWM_A, PWM_B, PWM_C, PWM_D, M1, M2, M3,
RESET_AB, RESET_CD
3.6 V
5.5 V
0.8 V
llkg
Input leakage current
OTW / FAULT
–100
100 μA
RINT_PU
Internal pullup resistance, OTW to VREG, FAULT to
VREG
20 26 35 kΩ
VOH
High-level output voltage
Internal pullup resistor only
External pullup of 4.7 kΩ to 5 V
2.95 3.3 3.65
V
4.5
5
VOL
Low-level output voltage
IO = 4 mA
0.2 0.4 V
(1) Specified by design
Copyright © 2009–2011, Texas Instruments Incorporated
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