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BQ25606 Datasheet, PDF (6/43 Pages) Texas Instruments – Standalone 3.0-A, Single Cell Battery Charger With 40V Over Voltage Protection Controller
bq25606
SLUSCK6 – MAY 2017
7 Specifications
www.ti.com
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
Voltage Range (with respect to
GND)
VAC
ACDRV
Voltage Range (with respect to
GND)
VBUS (converter not switching)(2)
Voltage Range (with respect to
GND)
BTST, PMID (converter not switching)(2)
Voltage Range (with respect to
GND)
SW
Voltage Range (with respect to
GND)
BTST to SW
Voltage Range (with respect to
GND)
D+, D–
Voltage Range (with respect to
GND)
REGN, TS, CE, PG, BAT, SYS (converter not switching)
Output Sink current
STAT
Voltage Range (with respect to
GND)
VSET, ILIM, ICHG, OTG
Voltage Range (with respect to
GND)
PGND to GND (QFN package only)
Operating junction temperature, TJ
Storage temperature, Tstg
Min
MAX
UNIT
–2
40
V
–0.3
40
V
–2
22
V
–0.3
22
V
–2
16
V
–0.3
7
V
–0.3
7
V
–0.3
7
V
6
mA
–0.3
7
V
–0.3
0.3
V
–40
150
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
(2) VBUS is specified up to 22 V for a maximum of 1 hour at room temperature
7.2 Recommended Operating Conditions
VBUS
Iin
ISYSOP
VBATOP
IBATOP
IBATOP
TA
Input voltage
Input current (VBUS)
Output current (SW)
Battery voltage
Fast charging current
Discharging current (continuous)
Operating ambient temperature
Min
NOM
MAX UNIT
3.9
13.5 (1)
V
3.25
A
3.0
A
4.4
V
3.0
A
6
A
–40
85
°C
(1) The inherent switching noise voltage spikes should not exceed the absolute maximum voltage rating on either the BTST or SW pins. A
tight layout minimizes switching noise.
7.3 Thermal information
THERMAL METRIC
RθJA
RθJC(top)
RθJB
ΨJT
ΨJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
6
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bq25606
RGE (VQFN)
24 Pins
31.9
27
9.2
0.4
9.2
2.8
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
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