CC2550_13 Datasheet, PDF (53/61 Pages) Texas Instruments – Low-Cost Low-Power 2.4 GHz RF Transmitter

29.1 Recommended PCB Layout for Package (QLP 16)
CC2550
Figure 24: Recommended PCB layout for QLP 16 package
Note: The figure is an illustration only and not to scale. There are five 10 mil diameter via holes
distributed symmetrically in the ground pad under the package. See also the CC2550EM
reference design [3].
29.2 Package Thermal Properties
Thermal Resistance
Air velocity [m/s]
0
Rth,j-a [K/W]
40.1
Table 28: Thermal Properties of QLP 16 Package
29.3 Soldering Information
The recommendations for lead-free reflow in IPC/JEDEC J-STD-020D should be followed.
SWRS039B
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