TMS570LS1227 Datasheet, PDF (5/184 Pages) Texas Instruments – TMS570LS1227 16- and 32-Bit RISC Flash Microcontroller

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TMS570LS1227
SPNS192B – OCTOBER 2012 – REVISED FEBRUARY 2015
Table of Contents
1 Device Overview ......................................... 1
1.1 Features .............................................. 1
1.2 Applications........................................... 2
1.3 Description............................................ 2
1.4 Functional Block Diagram ............................ 4
2 Revision History ......................................... 6
3 Device Comparison ..................................... 8
4 Terminal Configuration and Functions ............. 9
4.1 PGE QFP Package Pinout (144-Pin) ................. 9
4.2 ZWT BGA Package Ball-Map (337 Ball Grid Array) 10
4.3 Terminal Functions ................................. 11
5 Specifications .......................................... 44
5.1 Absolute Maximum Ratings Over Operating Free-
Air Temperature Range ............................ 44
5.2 ESD Ratings ........................................ 44
5.3 Power-On Hours (POH)............................. 44
5.4 Device Recommended Operating Conditions....... 45
5.5 Switching Characteristics Over Recommended
Operating Conditions for Clock Domains ........... 46
5.6 Wait States Required ............................... 46
5.7 Power Consumption Over Recommended
Operating Conditions................................ 47
5.8 Input/Output Electrical Characteristics Over
Recommended Operating Conditions............... 48
5.9 Thermal Resistance Characteristics ................ 48
5.10 Output Buffer Drive Strengths ...................... 49
5.11 Input Timings........................................ 50
5.12 Output Timings ...................................... 51
5.13 Low-EMI Output Buffers ............................ 53
6 System Information and Electrical
Specifications ........................................... 54
6.1 Device Power Domains ............................. 54
6.2 Voltage Monitor Characteristics ..................... 54
6.3 Power Sequencing and Power On Reset ........... 56
6.4 Warm Reset (nRST)................................. 58
6.5 ARM Cortex-R4F CPU Information ................. 59
6.6 Clocks ............................................... 62
6.7 Clock Monitoring .................................... 71
6.8 Glitch Filters......................................... 73
6.9 Device Memory Map ................................ 74
6.10 Flash Memory ....................................... 81
6.11 Tightly Coupled RAM Interface Module ............. 84
6.12 Parity Protection for Accesses to Peripheral RAMs 84
6.13 On-Chip SRAM Initialization and Testing ........... 86
6.14 External Memory Interface (EMIF) .................. 89
6.15 Vectored Interrupt Manager ......................... 97
6.16 DMA Controller..................................... 101
6.17 Real Time Interrupt Module ........................ 103
6.18 Error Signaling Module............................. 105
6.19 Reset / Abort / Error Sources...................... 109
6.20 Digital Windowed Watchdog....................... 112
6.21 Debug Subsystem ................................. 113
7 Peripheral Information and Electrical
Specifications ......................................... 118
7.1 Enhanced Translator PWM Modules (ePWM) ..... 118
7.2 Enhanced Capture Modules (eCAP)............... 123
7.3 Enhanced Quadrature Encoder (eQEP) ........... 125
7.4 Multibuffered 12bit Analog-to-Digital Converter.... 126
7.5 General-Purpose Input/Output ..................... 138
7.6 Enhanced High-End Timer (N2HET) .............. 139
7.7 FlexRay Interface .................................. 143
7.8 Controller Area Network (DCAN) .................. 145
7.9 Local Interconnect Network Interface (LIN)........ 146
7.10 Serial Communication Interface (SCI) ............. 147
7.11 Inter-Integrated Circuit (I2C) ....................... 148
7.12 Multibuffered / Standard Serial Peripheral
Interface............................................ 151
7.13 Ethernet Media Access Controller ................. 163
8 Device and Documentation Support .............. 167
8.1 Device and Development-Support Tool
Nomenclature ...................................... 167
8.2 Documentation Support............................ 169
8.3 Trademarks ........................................ 169
8.4 Electrostatic Discharge Caution ................... 169
8.5 Glossary............................................ 169
8.6 Device Identification................................ 170
8.7 Module Certifications............................... 172
9 Mechanical Packaging and Orderable
Information ............................................. 179
9.1 Packaging Information ............................. 179
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