TLC59291_16 Datasheet, PDF (5/46 Pages) Texas Instruments – 8/16-Channel, Constant Current LED Driver

www.ti.com
TLC59291
SLVSA96A – SEPTEMBER 2015 – REVISED MARCH 2016
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-
C101 ⁽²⁾
VALUE
±4000
±2000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
At T_A= –40°C to 85°C, unless otherwise noted.
PARAMETER
TEST CONDITIONS
DC Characteristics: V_CC = 3 V to 5.5 V
V_CC
Supply voltage
V_O
Voltage applied to output
V_IH
High-level input voltage
V_IL
Low-level input voltage
I_OH
High-level output current
I_OL
Low-level output current
I_OLC
Constant output sink current
OUT0 to OUT15
SIN, SCLK, LAT, BLANK
SIN, SCLK, LAT, BLANK
SOUT
SOUT
OUT0 to OUT15
OUT0 to OUT15
T_A
Operating free-air temperature range
T_J
Operating junction temperature range
AC Characteristics: V_CC = 3 V to 5.5 V
f_{CLK (SCLK)} Data shift clock frequency
SCLK
t_WH0
SCLK
t_WL0
SCLK
t_WH1
Pulse duration
(see Figure 1 and Figure 3)
LAT
t_WH2
BLANK
t_WL2
BLANK
t_SU0
Setup time
SIN to SCLK↑
t_SU1
(see Figure 1, Figure 3 and
LAT↑ to SCLK↑
t_SU2
Figure 4)
SCLK ↓to LAT↑
t_H0
Hold time
SIN to SCLK↑
t_H1
(see Figure 1, Figure 3, and
LAT↑ to SCLK↑
t_H2
Figure 13)
LAT↑ to SCLK ↓
3 V ≤ V_CC ≤ 3.6 V
3.6 V < V_CC ≤ 5.5 V
MIN
NOM
3
3.3
0.7 × V_CC
GND
–40
–40
10
10
20
40
40
5
200
10
3
10
40
MAX UNIT
5.5
V
10
V
V_CC
V
0.3 × V_CC
V
–2 mA
2 mA
40 mA
50 mA
85 °C
125 °C
33 MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
TLC59291
RGE (VQFN)
UNIT
24 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
38.1
45.3
16.9
°C/W
0.9
16.9
6.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2015–2016, Texas Instruments Incorporated
Product Folder Links: TLC59291
Submit Documentation Feedback
5