DRV8860_16 Datasheet, PDF (5/41 Pages) Texas Instruments – 8-Channel Serial Interface Low-Side Driver

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DRV8860, DRV8860A
SLRS065E – SEPTEMBER 2013 – REVISED NOVEMBER 2015
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ^{(1) (2) (3)}
Power supply voltage range
VM
Digital input pin current range
ENABLE, LATCH, CLK, DIN
Digital output pin voltage range DOUT, nFAULT
Digital output pin current
DOUT, nFAULT
Output voltage range
OUTx
Output current range
OUTx
Operating virtual junction temperature range, T_J
MIN
MAX
–0.3
40
0
20
–0.5
7
–0.5
7
–0.3
40
Internally limited
–40
150
UNIT
V
mA
V
V
V
A
°C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Power dissipation and thermal limits must be observed
7.2 Handling Ratings
T_stg
V_(ESD)
Storage temperature range
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins ⁽¹⁾
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins ⁽²⁾
MIN
–60
–2
–500
MAX
150
2
500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
°C
kV
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VM
Motor power supply voltage range
I_OUT
Low-side driver current capability
T_A
Operating ambient temperature range
MIN NOM MAX UNIT
8
38 V
560 mA
–40
85 °C
7.4 Thermal Information ⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC
TSSOP
PW (16 PINS)
HTSSOP
PWP (16 PINS)
UNIT
Θ_JA
R_θJC(TOP)
R_θJB
Ψ_JT
Ψ_JB
R_{θJC(BOTTOM)}
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
103
40.9
°C/W
37.9
28.5
°C/W
48
23.2
°C/W
3
0.9
°C/W
47.4
23.0
°C/W
N/A
3.0
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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