CC3220 Datasheet, PDF (5/84 Pages) Texas Instruments – SimpleLink Wi-Fi Wireless and Internet-of-Things Solution, a Single-Chip Wireless MCU

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CC3220
SWAS035A – SEPTEMBER 2016 – REVISED FEBRUARY 2017
Table of Contents
1 Device Overview ......................................... 1
1.1 Features .............................................. 1
1.2 Applications........................................... 2
1.3 Description............................................ 2
1.4 Functional Block Diagrams ........................... 4
2 Revision History ......................................... 5
3 Terminal Configuration and Functions.............. 6
3.1 Pin Diagram .......................................... 6
3.2 Pin Attributes and Pin Multiplexing ................... 7
3.3 Drive Strength and Reset States for Analog and
Digital Multiplexed Pins ............................. 23
3.4 Pad State After Application of Power To Chip But
Before Reset Release............................... 23
3.5 Connections for Unused Pins ....................... 24
4 Specifications ........................................... 25
4.1 Absolute Maximum Ratings ......................... 25
4.2 ESD Ratings ........................................ 25
4.3 Power-On Hours .................................... 25
4.4 Recommended Operating Conditions............... 25
4.5 Current Consumption Summary (CC3220R,
CC3220S) ........................................... 26
4.6 Current Consumption Summary (CC3200SF) ...... 27
4.7 TX Power and IBAT versus TX Power Level
Settings.............................................. 28
4.8 Brownout and Blackout Conditions ................. 30
4.9 Electrical Characteristics (3.3 V, 25°C) ............. 31
4.10 WLAN Receiver Characteristics .................... 33
4.11 WLAN Transmitter Characteristics .................. 33
4.12 WLAN Filter Requirements.......................... 34
4.13 Thermal Resistance Characteristics for RGK
Package ............................................. 34
4.14 Timing and Switching Characteristics ............... 34
5 Detailed Description ................................... 51
5.1 Overview ............................................ 51
5.2 Functional Block Diagram........................... 51
5.3 ARM^® Cortex^®-M4 Processor Core Subsystem .... 52
5.4 Wi-Fi Network Processor Subsystem ............... 52
5.5 Security.............................................. 55
5.6 Power-Management Subsystem .................... 58
5.7 Low-Power Operating Mode ........................ 59
5.8 Memory.............................................. 61
5.9 Restoring Factory Default Configuration ............ 64
5.10 Boot Modes.......................................... 64
6 Applications, Implementation, and Layout........ 66
6.1 Application Information .............................. 66
6.2 PCB Layout Guidelines ............................. 71
7 Device and Documentation Support ............... 74
7.1 Tools and Software ................................. 74
7.2 Device Nomenclature ............................... 75
7.3 Documentation Support ............................. 75
7.4 Community Resources .............................. 77
7.5 Trademarks.......................................... 78
7.6 Electrostatic Discharge Caution..................... 78
7.7 Export Control Notice ............................... 78
7.8 Glossary ............................................. 78
8 Mechanical, Packaging, and Orderable
Information .............................................. 79
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from September 28, 2016 to February 8, 2017
Page
• Changed the orderable part numbers in Device Information table ............................................................. 3
• Changed RF pins UNIT to dB ..................................................................................................... 25
• Added test conditions to V_OH and V_OL rows of Section 4.9 .................................................................... 31
• Changed "timing parameters" to "electrical specifications" .................................................................... 47
• Changed note from "Corrected through firmware" to "Offset error < 1 LSB. TI recommends using the ADC API
functions, which automatically compensate for offset error." .................................................................. 47
• Added note on GPIO_26 and GPIO_27.......................................................................................... 67
• Added Table 6-1 .................................................................................................................... 68
• Added Figure 6-2.................................................................................................................... 69
• Added Table 6-2 .................................................................................................................... 70
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Revision History
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