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BUF16821-Q1 Datasheet, PDF (5/38 Pages) Texas Instruments – Programmable Gamma-Voltage Generator
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BUF16821-Q1
SBOS712 – MAY 2014
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
VS
DVDD
TJ
Supply voltage
Digital power supply (VSD pin)
Digital input pins
SCL, SDA, AO, BKSEL: voltage
SCL, SDA, AO, BKSEL: current
Output pins, OUT1 through OUT16, VCOM1 and VCOM2(2)
Output short-circuit(3)
Ambient operating temperature
Junction temperature
MIN
–0.5
(V–) – 0.5
–40
MAX
22
6
6
±10
(V+) + 0.5
Continuous
95
125
UNIT
V
V
V
mA
V
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) See the Output Protection section.
(3) Short-circuit to ground, one amplifier per package.
6.2 Handling Ratings
Tstg
V(ESD)
Storage temperature range
Human body model (HBM), per AEC Q100-002(1)
Electrostatic discharge
Charged device model (CDM), per
AEC Q100-011
Corner pins (1, 14, 15,
and 28)
Other pins
MIN
–65
–2000
–750
–500
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
MAX
150
2000
750
500
UNIT
°C
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
VS
Supply voltage
9.0
DVDD
Digital power supply (VSD pin)
2.0
NOM
18.0
3.3
MAX
20.0
5.5
UNIT
V
V
6.4 Thermal Information
THERMAL METRIC(1)
BUF16821-Q1
PWP (HTSSOP)
UNIT
28 PINS
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
34.3
19.9
17.4
°C/W
0.7
17.2
3.0
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: BUF16821-Q1
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