CC3120MOD Datasheet, PDF (42/52 Pages) Texas Instruments – SimpleLink Wi-Fi CERTIFIED Network Processor Internet-of-Things Module Solution for MCU Applications

CC3120MOD
SWRS205 – MARCH 2017
www.ti.com
8.5 Soldering and Reflow Condition
• Heating method: Conventional convection or IR convection
• Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering
portion or equivalent method
• Solder paste composition: Sn/3.0 Ag/0.5 Cu
• Allowable reflow soldering times: 2 times based on the reflow soldering profile
(see Figure 8-1)
• Temperature profile: Reflow soldering will be done according to the temperature profile (see
Figure 8-1)
• Peak temp: 245°C
Figure 8-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component
(at Solder Joint)
NOTE
TI does not recommend the use of conformal coating or similar material on the SimpleLink
module. This coating can lead to localized stress on the WCSP solder connections inside the
module and impact the device reliability. Use caution during the module assembly process to
the final PCB to avoid the presence of foreign material inside the module.
42
Environmental Requirements and Specifications
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