CC2560A_16 Datasheet, PDF (40/51 Pages) Texas Instruments – Dual-Mode Bluetooth Controller

CC2560A NRND; CC2564 NRND
CC2560A, CC2560B, CC2564, CC2564B
SWRS121E – JULY 2012 – REVISED JANUARY 2016
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9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
9.1 mrQFN Mechanical Data
RVM (S-PVQFN-N76)
PLASTIC QUAD FLATPACK NO-LEAD
8,10
7,90 ^SQ
7,83
7,63 ^SQ
Pin 1 Indentifier
0,90
0,80
0,08 C
0,30 TYP
4X 5,40
4X 4,80
0,65
0,55
Seating Plane
0,05
0,00
CL –
PKG.
CL –
PAD
0,60
4X _0,24
4X ^0,60
0,24
THERMAL PAD
SIZE AND SHAPE
SHOWN ON SEPARATE SHEET
4X 0,70
0,17
0,60
0,25
76X _0,15
0,10
CAB
0,50
76X _0,30
0,10
CAB
NOTES:
Bottom View
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5-1994.
B. This drawing is subject to change without notice.
C. QFN (Quad Flatpack No-Lead) Package configuration.
D. The package thermal pad must be soldered to the board for thermal and mechanical performance.
E. See the additional figure in the Product Data Sheet for details regarding the exposed thermal pad features and dimensions.
4211965/B 12/11
SWRS115-001
40
Mechanical, Packaging, and Orderable Information
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