TLC082-Q1_16 Datasheet, PDF (4/38 Pages) Texas Instruments – Wide-Bandwidth High-Output-Drive Single-Supply Operational Amplifiers

TLC082-Q1, TLC084-Q1
SLOS510D – SEPTEMBER 2006 – REVISED AUGUST 2016
6 Specifications
www.ti.com
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_DD
V_ID
T_J
T_A
T_J(max)
T_stg
Supply voltage⁽²⁾
Differential input voltage
Continuous total power dissipation
Operating junction temperature
Operating ambient temperature
Maximum junction temperature
Storage temperature
MIN
MAX
–0.3
17
±V_DD
See Thermal Information
–40
125
–40
125
150
–65
150
UNIT
V
V
°C
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to GND.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
All pins
Corner pins (1, 4, 5, and 8)
VALUE
±2000
±500
±750
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
6.3 Recommended Operating Conditions
V_DD
V_ICR
T_J
Single supply
Supply voltage
Split supply
Common-mode input voltage
Operating junction temperature
MIN MAX
4.5
16
±2.25
±8
GND V_DD – 2
–40
125
UNIT
V
V
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
TLC082-Q1
DGN (MSOP-PowerPAD)
TLC084-Q1
PWP (HTSSOP)
UNIT
8-PIN
20-PIN
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
58.1
40
°C/W
55.2
46.7
°C/W
35.3
22.9
°C/W
2.1
1
°C/W
35.9
26.7
°C/W
6.9
2.6
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
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