TLC082-Q1_16 Datasheet, PDF (23/38 Pages) Texas Instruments – Wide-Bandwidth High-Output-Drive Single-Supply Operational Amplifiers

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Typical Applications (continued)
9.2.2.3 Application Curve
Input
Output
TLC082-Q1, TLC084-Q1
SLOS510D – SEPTEMBER 2006 – REVISED AUGUST 2016
Figure 47. Dual Supply Application at 1-MHz Input Signal
10 Power Supply Recommendations
The TLC08x-Q1 operational amplifier is specified for use on a single supply from 4.5 V to 16 V (or a dual supply
from over a temperature range of −40°C to 125°C. The device continues to function below this range, but
performance is not specified. Place bypass capacitors close to the power supply pins to reduce noise coupling in
from noisy or high-impedance power supplies. For more detailed information on bypass capacitor placement, see
Layout Guidelines.
11 Layout
11.1 Layout Guidelines
To achieve the levels of high performance of the TLC08x-Q1, follow proper printed-circuit board (PCB) design
techniques. A general set of guidelines is given in the following.
Ground planes TI highly recommends using a ground plane on the board to provide all components with a low-
inductive ground connection. However, in the areas of the amplifier inputs and output, the ground
plane can be removed to minimize the stray capacitance.
Proper power-supply decoupling Use a 6.8-μF tantalum capacitor in parallel with a 0.1-μF ceramic capacitor
on each supply terminal. It may be possible to share the tantalum among several amplifiers
depending on the application, but a 0.1-μF ceramic capacitor should always be used on the supply
terminal of every amplifier. In addition, the 0.1-μF capacitor should be placed as close as possible
to the supply terminal. As this distance increases, the inductance in the connecting trace makes the
capacitor less effective. The designer should strive for distances of less than 0.1 inches between
the device power terminals and the ceramic capacitors.
Sockets
Sockets can be used but are not recommended. The additional lead inductance in the socket pins
will often lead to stability problems. Surface-mount packages soldered directly to the PCB is the
best implementation.
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Product Folder Links: TLC082-Q1 TLC084-Q1