THS6212 Datasheet, PDF (4/48 Pages) Texas Instruments – Differential, Line-Driver Amplifier

THS6212
SBOS758 – MAY 2016
6 Specifications
www.ti.com
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage, V_S– to V_S+
Input voltage, V_I
Differential input voltage, V_ID
Output current, I_O
Continuous power dissipation
Maximum junction temperature, T_J
Static dc⁽²⁾
Under any condition⁽³⁾
Continuous operation, long-term reliability⁽⁴⁾
Storage temperature, T_stg
MIN
MAX
28
±V_S
±2
±500
See Thermal Information table
150
130
–65
150
UNIT
V
V
V
mA
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The THS6212 incorporates a thermal pad on the underside of the device. This pad functions as a heatsink and must be connected to a
thermally dissipating plane for proper power dissipation. Failure to do so can result in exceeding the maximum junction temperature,
which can permanently damage the device.
(3) The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
(4) The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature can result in reduced reliability or lifetime of the device.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
Machine model (MM)
VALUE
±2000
±500
±100
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_S
Supply voltage, V_S– to V_S+
T_J
Operating junction temperature
T_A
Ambient operating air temperature
MIN
NOM
MAX UNIT
10
28
V
130
°C
25
85
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
THS6212
RHF (VQFN)
UNIT
24 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
33.2
°C/W
31.7
°C/W
11.3
°C/W
0.4
°C/W
11.3
°C/W
3.9
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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