THS6212 Datasheet, PDF (37/48 Pages) Texas Instruments – Differential, Line-Driver Amplifier

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THS6212
SBOS758 – MAY 2016
Board Layout Guidelines (continued)
Treat the trace as a capacitive load in this case and set the series resistor value as shown in the
recommended R_S versus capacitive load plots. However, this configuration does not preserve signal integrity
as well as a doubly-terminated line. If the input impedance of the destination device is low, there is some
signal attenuation as a result of the voltage divider formed by the series output into the terminating
impedance.
e. Socketing a high-speed part such as the THS6212 is not recommended. The additional lead length and pin-
to-pin capacitance introduced by the socket can create an extremely troublesome parasitic network, and can
make achieving a smooth, stable frequency response almost impossible. Best results are obtained by
soldering the THS6212 directly onto the board.
f. Use the –V_S plane to conduct heat out of the package. The package attaches the die directly to an exposed
thermal pad on the bottom, and must be soldered to the board. This pad must be connected electrically to
the same voltage plane as the most negative supply applied to the THS6212 (in Figure 84, this supply is
–12 V).
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