TCA9548A_15 Datasheet, PDF (4/35 Pages) Texas Instruments – Low-Voltage 8-Channel I2C Switch With Reset

TCA9548A
SCPS207E – MAY 2012 – REVISED OCTOBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
V_CC
Supply voltage
V_I
Input voltage⁽²⁾
I_I
Input current
I_O
Output current
I_CC
Supply current
T_stg
Storage temperature
MIN
–0.5
–0.5
–20
–25
–100
–65
MAX
7
7
20
100
150
UNIT
V
V
mA
mA
mA
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±2000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
V_CC
Supply voltage
V_IH
High-level input voltage
V_IL
Low-level input voltage
T_A
Operating free-air temperature
SCL, SDA
A2–A0, RESET
SCL, SDA
A2–A0, RESET
MIN
1.65
0.7 × V_CC
0.7 × V_CC
–0.5
–0.5
–40
MAX
5.5
6
V_CC + 0.5
0.3 × V_CC
0.3 × V_CC
85
UNIT
V
V
V
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
TCA9548A
PW (TSSOP) RGE (VQFN)
UNIT
24 PINS
24 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
108.8
54.1
62.7
10.9
62.3
N/A
57.2
°C/W
62.5
°C/W
34.4
°C/W
3.8
°C/W
34.4
°C/W
15.5
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
Submit Documentation Feedback
Product Folder Links: TCA9548A
Copyright © 2012–2015, Texas Instruments Incorporated