TCA9534_16 Datasheet, PDF (4/38 Pages) Texas Instruments – Low Voltage 8-Bit I2C and SMBUS Low-Power I/O Expander with Interrupt Output and Configuration Registers

TCA9534
SCPS197B – SEPTEMBER 2014 – REVISED NOVEMBER 2016
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
V_CC
V_I
V_O
I_IK
I_OK
I_IOK
I_OL
I_OH
I_CC
T_J(MAX)
T_stg
Supply voltage
Input voltage ⁽²⁾
Output voltage⁽²⁾
Input clamp current
V_I < 0
Output clamp current
V_O < 0
Input-output clamp current
V_O < 0 or V_O > V_CC
Continuous output low current through a single P-port V_O = 0 to V_CC
Continuous output high current through a single P-port V_O = 0 to V_CC
Continuous current through GND by all P-ports, INT, and SDA
Continuous current through V_CC by all P-ports
Maximum junction temperature
Storage temperature
MIN
MAX
UNIT
–0.5
6
V
–0.5
6
V
–0.5
6
V
–20
mA
–20
mA
±20
mA
50
mA
–50
mA
250
mA
–160
100
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
6.2 Handling Ratings
V_(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins ⁽²⁾
VALUE
±2000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
MIN
MAX UNIT
V_CC
V_IH
V_IL
I_OH
I_OL ⁽²⁾
I_CC
T_A
Supply voltage
High-level input voltage
Low-level input voltage
High-level output current
SCL, SDA
A0, A1, A2, P7–P0
SCL, SDA
A0, A1, A2, P7–P0
Any P-port, P7–P0
V_CC = 1.65 V to 5.5 V
V_CC = 1.65 V to 2.7 V
V_CC = 1.65 V to 5.5 V
V_CC = 1.65 V to 2.7 V
V_CC = 3 V to 5.5 V
Low-level output current
Continuous current through GND
T_j ≤ 65°C
P00–P07, P10–P17
T_j ≤ 85°C
T_j ≤ 105°C
INT, SDA
T_j ≤ 85°C
T_j ≤ 105°C
All P-ports P7-P0, INT, and SDA
Continuous current through V_CC All P-ports P7-P0
Operating free-air temperature
1.65
5.5 V
0.7 × V_CC
0.7 × V_CC
V_CC ⁽¹⁾
V
5.5
–0.5 0.3 × V_CC
–0.5 0.3 × V_CC V
–0.5 0.2 × V_CC
–10 mA
25
18
9 mA
6
3
200
mA
–80
–40
85 °C
(1) The SCL and SDA pins shall not be at a higher potential than the supply voltage V_CC in the application, or an increase in leakage
current, I_I, results.
(2) The values shown apply to specific junction temperatures. See the Calculating Junction Temperature and Power Dissipation section on
how to calculate the junction temperature.
4
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