MSP430FR59691 Datasheet, PDF (4/131 Pages) Texas Instruments – MSP430FR59xx Mixed-Signal Microcontrollers

MSP430FR5969, MSP430FR59691, MSP430FR5968, MSP430FR5967
MSP430FR5959, MSP430FR5958, MSP430FR5957
MSP430FR5949, MSP430FR5948, MSP430FR5947, MSP430FR59471
SLAS704C – OCTOBER 2012 – REVISED JUNE 2014
www.ti.com
Table of Contents
1 Device Overview ......................................... 1
1.1 Features .............................................. 1
1.2 Applications........................................... 1
1.3 Description............................................ 2
1.4 Functional Block Diagram ............................ 3
2 Revision History ......................................... 4
3 Device Comparison ..................................... 5
4 Terminal Configuration and Functions.............. 6
4.1 Pin Diagram – RGZ Package – MSP430FR596x
and MSP430FR596x1 ................................ 6
4.2 Pin Diagram – RHA Package – MSP430FR594x
and MSP430FR594x1 (LFXT Only) ................. 7
4.3 Pin Diagram – DA Package – MSP430FR594x
(LFXT Only) .......................................... 8
4.4 Pin Diagram – RHA Package – MSP430FR595x
(HFXT Only) ......................................... 9
4.5 Pin Diagram – DA Package – MSP430FR595x
(HFXT Only) ........................................ 10
4.6 Signal Descriptions.................................. 11
4.7 Pin Multiplexing ..................................... 16
4.8 Connection of Unused Pins ......................... 16
5 Specifications ........................................... 17
5.1 Absolute Maximum Ratings ......................... 17
5.2 Handling Ratings .................................... 17
5.3 Recommended Operating Conditions............... 17
5.4 Active Mode Supply Current Into V_CC Excluding
External Current .................................... 18
5.5 Typical Characteristics - Active Mode Supply
Currents ............................................. 19
5.6 Low-Power Mode (LPM0, LPM1) Supply Currents
Into V_CC Excluding External Current ................ 19
5.7 Low-Power Mode (LPM2, LPM3, LPM4) Supply
Currents (Into V_CC) Excluding External Current .... 20
5.8 Low-Power Mode (LPM3.5, LPM4.5) Supply
Currents (Into V_CC) Excluding External Current .... 21
5.9 Typical Characteristics, Low-Power Mode Supply
Currents ............................................. 22
5.10 Typical Characteristics, Current Consumption per
Module .............................................. 23
5.11 Thermal Packaging Characteristics ................ 23
5.12 Timing and Switching Characteristics ............... 24
5.13 Emulation and Debug ............................... 50
6 Detailed Description ................................... 51
6.1 Overview ............................................ 51
6.2 CPU ................................................. 51
6.3 Operating Modes .................................... 52
6.4 Interrupt Vector Table and Signatures .............. 53
6.5 Memory Organization ............................... 56
6.6 Bootstrap Loader (BSL) ............................. 56
6.7 JTAG Operation ..................................... 57
6.8 FRAM Memory ...................................... 58
6.9 Memory Protection Unit Including IP Encapsulation 58
6.10 Peripherals .......................................... 59
6.11 Input/Output Schematics ........................... 79
6.12 Device Descriptors (TLV) .......................... 106
6.13 Identification........................................ 108
7 Applications, Implementation, and Layout ...... 109
7.1 Device Connection and Layout Fundamentals .... 109
7.2 Peripheral- and Interface-Specific Design
Information ......................................... 112
8 Device and Documentation Support .............. 114
8.1 Device Support..................................... 114
8.2 Documentation Support............................ 117
8.3 Trademarks ........................................ 118
8.4 Electrostatic Discharge Caution ................... 118
8.5 Export Control Notice .............................. 118
8.6 Glossary............................................ 118
9 Mechanical Packaging and Orderable
Information ............................................. 118
9.1 Packaging Information ............................. 118
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE
REVISION NOTES
June 2014
C
Section 6.8, Added the paragraph that starts "For important software design information regarding
FRAM..."
4
Revision History
Copyright © 2012–2014, Texas Instruments Incorporated
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Product Folder Links: MSP430FR5969 MSP430FR59691 MSP430FR5968 MSP430FR5967 MSP430FR5959
MSP430FR5958 MSP430FR5957 MSP430FR5949 MSP430FR5948 MSP430FR5947 MSP430FR59471