LP3950 Datasheet, PDF (4/38 Pages) National Semiconductor (TI) – Color LED Driver with Audio Synchronizer

LP3950
SNVS331C – NOVEMBER 2004 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings^(1)(2)(3)
V (SW, FB, R1–2, G1–2, B1–2) ^{(4) (5)}
V_DD1, V_DD2, V_DDIO, V_DDA
Voltage on ASE, AD1, AD2
Voltage on Logic Pins
I (R1, G1, B1, R2, G2, B2) ⁽⁶⁾
I (V_REF)
Continuous Power Dissipation ⁽⁷⁾
Junction Temperature (T_J-MAX)
Storage Temperature Range
Maximum Lead Temperature
(Reflow soldering, 3 times) ⁽⁸⁾
ESD Rating ⁽⁹⁾
Human Body Model:
Machine Model:
−0.3V to +7.2V
−0.3V to +6.0V
−0.3V to V_DD1 +0.3V with 6.0V max
−0.3V to V_{DD_IO}+0.3V with 6.0V max
150 mA
10 µA
Internally Limited
125°C
−65°C to +150°C
260°C
2 kV
200V
(1) All voltages are with respect to the potential at the GND pins (GND1–3, GND_BOOST, GND_RGB, GNDA).
(2) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) Battery/Charger voltage should be above 6.0V no more than 10% of the operational lifetime.
(5) Voltage tolerance of LP3950 above 6.0V relies on fact that V_DD1, V_DD2 and V_DDA (2.8V) are available (ON) at all conditions. If V_DD1,
V_DD2 and V_DDA are not available (ON) at all conditions, Texas Instruments does not guarantee any parameters or reliability for this
device. Also, V_DD1, V_DD2 and V_DDA must be at the same electric potential.
(6) The total load current of the boost converter should be limited to 300 mA.
(7) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T_J = 160°C (typ.) and
disengages at T_J = 140°C (typ.).
(8) For detailed package and soldering specifications and information, please refer to Texas Instruments Application Note 1125 (SNAA002):
Laminate CSP/FBGA.
(9) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin. MIL-STD-883 3015.7
Operating Ratings⁽¹⁾⁽²⁾
V (SW, FB, R1–2, G1–2, B1–2)
V_DD1, V_DD2, V_DDA ⁽³⁾
V_DDIO
Voltage on ASE, AD1, AD2
Recommended Load Current
0V to 6.0V
2.7V to 2.9V
1.65V to V_DD1,2 V
0.1V to V_DD1 - 0.1V
0 mA to 300 mA
Junction Temperature (T_J) Range
Ambient Temperature (T_A) Range ⁽⁴⁾
−40°C to +125°C
−40°C to +85°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pins (GND1–3, GND_BOOST, GND_RGB, GNDA).
(3) Voltage tolerance of LP3950 above 6.0V relies on fact that V_DD1, V_DD2 and V_DDA (2.8V) are available (ON) at all conditions. If V_DD1,
V_DD2 and V_DDA are not available (ON) at all conditions, Texas Instruments does not guarantee any parameters or reliability for this
device. Also, V_DD1, V_DD2 and V_DDA must be at the same electric potential.
(4) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T_A-MAX) is dependent on the maximum operating junction temperature (T_J-MAX-OP =
125°C), the maximum power dissipation of the device in the application (P_D-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (θ_JA), as given by the following equation: T_A-MAX = T_J-MAX-OP − (θ_JA x P_D-MAX).
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