DRV8804_16 Datasheet, PDF (4/27 Pages) Texas Instruments – Quad Serial Interface Low-Side Driver IC

DRV8804
SLVSAW4F – JULY 2011 – REVISED DECEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
VM
VOUTx
VCLAMP
SDATOUT,
nFAULT
SDATOUT,
nFAULT
T_J
T_stg
Power supply voltage
Output voltage
Clamp voltage
Output current
Peak clamp diode current
DC or RMS clamp diode current
Digital input pin voltage
Digital output pin voltage
Peak motor drive output current, t < 1 μs
Continuous total power dissipation
Operating virtual junction temperature
Storage temperature
(1) All voltage values are with respect to network ground terminal.
MIN
MAX
–0.3
65
–0.3
65
–0.3
65
20
2
1
–0.5
7
–0.5
7
Internally limited
See Thermal Information
–40
150
–60
150
UNIT
V
V
V
mA
A
A
V
V
A
°C
°C
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins ⁽²⁾
VALUE
±3000
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
V_M
V_CLAMP
I_OUT
Power supply voltage
Output clamp voltage⁽¹⁾
Continuous output current, single channel on, T_A = 25°C, SOIC package⁽²⁾
Continuous output current, four channels on, T_A = 25°C, SOIC package⁽²⁾
Continuous output current, single channel on, T_A = 25°C, HTSSOP package⁽²⁾
Continuous output current, four channels on, T_A = 25°C, HTSSOP package⁽²⁾
(1) V_CLAMP is used only to supply the clamp diodes. It is not a power supply input.
(2) Power dissipation and thermal limits must be observed.
MIN NOM
8.2
0
MAX
60
60
1.5
0.8
2
1
UNIT
V
V
A
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
DRV8804
DW (SOIC) PWP (HTSSOP)
20 PINS
16 PINS
67.7
39.6
32.9
24.6
35.4
20.3
8.2
0.7
34.9
20.1
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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