BQ27532-G1 Datasheet, PDF (4/35 Pages) Texas Instruments – Battery Management Unit Impedance Track Fuel Gauge

bq27532-G1
SLUSBU6B – SEPTEMBER 2014 – REVISED JANUARY 2016
6 Specifications
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6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
V_REGIN
V_CE
V_CC
V_IOD
V_BAT
V_I
T_A
T_stg
Regulator input
CE input pin
Supply voltage
Open-drain IO pins (SDA, SCL, SOC_INT)
BAT input pin
Input voltage to all other pins
(BI/TOUT, TS, SRP, SRN, BSCL, BSDA)
Operating free-air temperature
Storage temperature
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
–0.3
MAX
5.5
6 ⁽²⁾
V_REGIN + 0.3
2.75
5.5
5.5
6 ⁽²⁾
V_CC + 0.3
–40
85
–65
150
UNIT
V
V
V
V
V
V
V
V
°C
°C
(1) Stresses beyond those listed as absolute maximum ratings may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated as recommended operating conditions is
not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Condition not to exceed 100 hours at 25°C lifetime.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, BAT pin⁽¹⁾
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, All other pins⁽¹⁾
Charged device model(CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±1500
±2000
±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
T_A = –40°C to 85°C, V_REGIN = V_BAT = 3.6 V (unless otherwise noted)
V_REGIN
C_REGIN
C_LDO25
t_PUCD
Supply voltage
No operating restrictions
No flash writes
External input capacitor for internal LDO
between REGIN and V_SS
External output capacitor for internal LDO
between V_CC and V_SS
Power-up communication delay
Nominal capacitor values specified.
Recommend a 5% ceramic X5R-type
capacitor located close to the device.
MIN
NOM
MAX UNIT
2.8
4.5
V
2.45
2.8
0.1
μF
0.47
1
μF
250
ms
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
bq27532-G1
YZF (CSP)
UNIT
15 PINS
R_θJA
R_JC(top)
R_θJB
ψ_JT
ψ_JB
R_{θJC(bottom)}
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
70
°C/W
17
°C/W
20
°C/W
1
°C/W
18
°C/W
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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