THS4271-EP Datasheet, PDF (3/44 Pages) Texas Instruments – LOW NOISE, HIGH SLEW RATE, UNITY GAIN STABLE VOLTAGE FEEDBACK AMPLIFIER

THS4271-EP
www.ti.com
SGLS270C – DECEMBER 2004 – REVISED APRIL 2010
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range unless otherwise noted⁽¹⁾
V_S
V_I
I_O
T_J
T_J ⁽²⁾
T_J ⁽³⁾
T_stg
Supply voltage
Input voltage
Output current
Continuous power dissipation
Maximum junction temperature
Maximum junction temperature, continuous operation long term reliability
Maximum junction temperature to prevent oscillation
Storage temperature range
Lead temperature (1,6 mm (1/16 inch) from case for 10 seconds)
HBM
ESD ratings CDM
MM
UNIT
16.5 V
±V_S
100 mA
See Dissipation Ratings Table
+150°C
+125°C
+60°C
–65°C to +150°C
+300°C
3000 V
1000 V
100 V
(1) The absolute maximum temperature under any condition is limited by the constraints of the silicon process. Stresses above these
ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not
implied.
(2) Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of
overall device life. See Figure 1 for additional information on thermal derating.
(3) See Maximum Die Temperature to Prevent Oscillation section in the Application Information of this data sheet.
PACKAGE DISSIPATION RATINGS
PACKAGE
DGN (8 pin)⁽²⁾
q_JC
(°C/W)
4.7
q_JA ⁽¹⁾
(°C/W)
58.4
(1) This data was taken using the JEDEC standard High-K test PCB.
(2) The THS4271 may incorporate a PowerPAD™ on the underside of the chip. This feature acts as a
heat sink and must be connected to a thermally dissipative plane for proper power dissipation. Failure
to do so may result in exceeding the maximum junction temperature which could permanently damage
the device. See TI technical briefs SLMA002 and SLMA004 for more information about utilizing the
PowerPAD thermally enhanced package.
Copyright © 2004–2010, Texas Instruments Incorporated
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