THS4271-EP Datasheet, PDF (20/44 Pages) Texas Instruments – LOW NOISE, HIGH SLEW RATE, UNITY GAIN STABLE VOLTAGE FEEDBACK AMPLIFIER

THS4271-EP
SGLS270C – DECEMBER 2004 – REVISED APRIL 2010
www.ti.com
APPLICATION INFORMATION
MAXIMUM DIE TEMPERATURE TO PREVENT
OSCILLATION
The THS4271 may have low-level oscillation when
the die temperature (also called junction temperature)
exceeds +60°C and is not recommended for new
designs.
The oscillation is a result of the internal design of the
bias circuit, and external configuration is not expected
to mitigate or reduce the problem. This problem
occurs randomly because of normal process
variations and normal testing cannot identify problem
units.
The die temperature depends on the power
dissipation and the thermal resistance of the device.
Die Temperature = P_DISS × q_JA + T_A
Where:
P_DISS = (V_S+– V_S–) × (I_Q + I_LOAD) – (V_OUT × I_LOAD)
Table 1 shows the estimated the maximum ambient
temperature (T_A max) in degrees Celsius for each
package option of the THS4271 using the thermal
dissipation rating given in the Dissipation Ratings
table for a JEDEC standard High-K test PCB. For
each case shown, R_L = 499 Ω to ground and the
quiescent current = 27 mA (the maximum over the
0°C to +70°C temperature range). The last entry for
each package option (shaded cells) lists the
worst-case scenario where the power supply is
single-supply 10 V and ground and the output voltage
is 5 V DC.
space
The die temperature can be approximated with the
following formula:
Table 1. Estimated Maximum Ambient Temperature Per Package Option
PACKAGE
DEVICE
PowerPad™ MSOP
THS4271DGN
THS4271DGNR
Worst Case
V_S+
5V
10 V
V_S–
–5 V
0V
V_OUT
0V
2 V_PP
4 V_PP
6 V_PP
8 V_PP
5 DC
q_JA
58.4°C/W
T_A max
44.2°C
43.5°C
42.8°C
42.3°C
41.9°C
41.3°C
20
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