THS4271-EP Datasheet, PDF (29/44 Pages) Texas Instruments – LOW NOISE, HIGH SLEW RATE, UNITY GAIN STABLE VOLTAGE FEEDBACK AMPLIFIER

THS4271-EP
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5. Socketing a high speed part like the THS4271
is not recommended. The additional lead length
and pin-to-pin capacitance introduced by the
socket can create a troublesome parasitic
network which can make it almost impossible to
achieve a smooth, stable frequency response.
Best results are obtained by soldering the
THS4271 onto the board.
PowerPAD™ DESIGN CONSIDERATIONS
The THS4271 is available in a thermally-enhanced
PowerPAD family of packages. These packages are
constructed using a downset leadframe upon which
the die is mounted [see Figure 90(a) and
Figure 90(b)]. This arrangement results in the lead
frame being exposed as a thermal pad on the
underside of the package [see Figure 90(c)]. Because
this thermal pad has direct thermal contact with the
die, excellent thermal performance can be achieved
by providing a good thermal path away from the
thermal pad.
The PowerPAD package allows both assembly and
thermal management in one manufacturing operation.
During the surface-mount solder operation (when the
leads are being soldered), the thermal pad can also
be soldered to a copper area underneath the
package. Through the use of thermal paths within this
copper area, heat can be conducted away from the
package into either a ground plane or other heat
dissipating device.
The PowerPAD package represents a breakthrough
in combining the small area and ease of assembly of
surface mount with the heretofore awkward
mechanical methods of heatsinking.
DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
Figure 90. Views of Thermally
Enhanced Package
Although there are many ways to properly heatsink
the PowerPAD package, the following steps illustrate
the recommended approach.
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space
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SGLS270C – DECEMBER 2004 – REVISED APRIL 2010
PowerPAD PCB LAYOUT CONSIDERATIONS
1. Prepare the PCB with a top side etch pattern as
shown in Figure 91. There should be etch for the
leads as well as etch for the thermal pad.
ÎÎÎÎÎÎÎ _{Single or Dual}
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ_{68 Mils x 70 Mils}
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎ(Via diameter = 13mils)
Figure 91. PowerPAD PCB Etch
and Via Pattern
2. Place five holes in the area of the thermal pad.
The holes should be 13 mils in diameter. Keep
them small so that solder wicking through the
holes is not a problem during reflow.
3. Additional vias may be placed anywhere along
the thermal plane outside of the thermal pad
area. They help dissipate the heat generated by
the THS4271 IC. These additional vias may be
larger than the 13-mil diameter vias directly under
the thermal pad. They can be larger because
they are not in the thermal pad area to be
soldered, so that wicking is not a problem.
4. Connect all holes to the internal ground plane.
5. When connecting these holes to the ground
plane, do not use the typical web or spoke via
connection methodology. Web connections have
a high thermal resistance connection that is
useful for slowing the heat transfer during
soldering operations. This resistance makes the
soldering of vias that have plane connections
easier. In this application, however, low thermal
resistance is desired for the most efficient heat
transfer. Therefore, the holes under the THS4271
PowerPAD package should make their
connection to the internal ground plane, with a
complete connection around the entire
circumference of the plated-through hole.
6. The top-side solder mask should leave the
terminals of the package and the thermal pad
area with its five holes exposed. The bottom-side
solder mask should cover the five holes of the
thermal pad area. This prevents solder from
being pulled away from the thermal pad area
during the reflow process.
7. Apply solder paste to the exposed thermal pad
area and all of the IC terminals.
8. With these preparatory steps in place, the IC is
simply placed in position and run through the
solder reflow operation as any standard
surface-mount component. This results in a part
that is properly installed.
Copyright © 2004–2010, Texas Instruments Incorporated
Product Folder Link(s): THS4271-EP
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